A low-power and real-time augmented reality processor for the next generation smart glasses

Gyeonghoon Kim, H. Yoo
{"title":"A low-power and real-time augmented reality processor for the next generation smart glasses","authors":"Gyeonghoon Kim, H. Yoo","doi":"10.1109/HOTCHIPS.2015.7477476","DOIUrl":null,"url":null,"abstract":"This article consists of a single slide from the authors' conference presentation. Topics covered include: hardware requirements of augmented reality in smart glasses systems; algorithm-hardware mapping and network congestion problem; neural network scheduler for 2-D-mesh network-on-chip; and chip and smart glass system implementation.","PeriodicalId":6666,"journal":{"name":"2015 IEEE Hot Chips 27 Symposium (HCS)","volume":"1 1","pages":"1-1"},"PeriodicalIF":0.0000,"publicationDate":"2015-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE Hot Chips 27 Symposium (HCS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HOTCHIPS.2015.7477476","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

This article consists of a single slide from the authors' conference presentation. Topics covered include: hardware requirements of augmented reality in smart glasses systems; algorithm-hardware mapping and network congestion problem; neural network scheduler for 2-D-mesh network-on-chip; and chip and smart glass system implementation.
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用于下一代智能眼镜的低功耗实时增强现实处理器
本文由作者会议演讲中的一张幻灯片组成。涵盖的主题包括:智能眼镜系统中增强现实的硬件要求;算法-硬件映射与网络拥塞问题;二维网格片上网络的神经网络调度以及芯片和智能玻璃系统的实现。
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