Weiqing Li, Lei Jin, Jiaqiang Yang, Zhaofu Wang, Fang-Zu Yang, Dongping Zhan, Z. Tian
{"title":"Effects of Additive on the Electrodeposition and Coating Structure in a Novel System of Electronic Copper Electroplating","authors":"Weiqing Li, Lei Jin, Jiaqiang Yang, Zhaofu Wang, Fang-Zu Yang, Dongping Zhan, Z. Tian","doi":"10.7503/CJCU20210225","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":9791,"journal":{"name":"高等学校化学学报","volume":null,"pages":null},"PeriodicalIF":0.7000,"publicationDate":"2021-09-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"高等学校化学学报","FirstCategoryId":"92","ListUrlMain":"https://doi.org/10.7503/CJCU20210225","RegionNum":4,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"CHEMISTRY, MULTIDISCIPLINARY","Score":null,"Total":0}