Effects of Additive on the Electrodeposition and Coating Structure in a Novel System of Electronic Copper Electroplating

IF 0.7 4区 化学 Q4 CHEMISTRY, MULTIDISCIPLINARY 高等学校化学学报 Pub Date : 2021-09-10 DOI:10.7503/CJCU20210225
Weiqing Li, Lei Jin, Jiaqiang Yang, Zhaofu Wang, Fang-Zu Yang, Dongping Zhan, Z. Tian
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来源期刊
高等学校化学学报
高等学校化学学报 化学-化学综合
CiteScore
1.60
自引率
20.00%
发文量
17957
审稿时长
5.5 months
期刊介绍:
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