MOLECULAR DYNAMICS SIMULATION OF MICROSTRUCTURAL CHANGE OF Cu0.6Ni0.2Fe0.2 ALLOY DURING THE COOLING PROCESS

Thao Nguyen Thi, Thanh Nguyen Thi Thanh
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Abstract

Molecular dynamic simulation has been used to study the microstructural change of Cu0.6Ni0.2Fe0.2 consisting of 8788 atoms (5272 Cu, 1758 Ni, and 1758 Fe atoms) during the cooling process. The influence of temperature on the microstructural properties is studied in detail through the atomic potential energy, the radial distribution function, the number of types of atoms present in the sample, the distribution of coordination number, and simplex distribution. Simulation results indicate that a crystalline phase transition occurs when the sample was cooled. The range of transition temperature is the range at which the atomic potential energy changes dramatically. This sample consists of facecentered cubic (fcc) and hexagonal closed packed crystals alternated with amorphous structures. The number of the simplex with radii larger than 1.9 Å decreased rapidly as the sample changed to a crystalline state.
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Cu0.6Ni0.2Fe0.2合金冷却过程中组织变化的分子动力学模拟
采用分子动力学模拟方法研究了由8788个原子(5272 Cu, 1758 Ni和1758 Fe原子)组成的Cu0.6Ni0.2Fe0.2在冷却过程中的微观组织变化。通过原子势能、径向分布函数、样品中存在的原子类型数、配位数分布和单纯形分布,详细研究了温度对微观组织性能的影响。模拟结果表明,样品在冷却过程中发生了结晶相变。跃迁温度的范围是原子势能发生剧烈变化的范围。该样品由面心立方(fcc)和六边形封闭堆积晶体组成,并与非晶态结构交替存在。当样品变为结晶态时,半径大于1.9 Å的单晶数量迅速减少。
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