Chemically Modified Electrodes for Recessed Microelectrode Array

N.A. Mohd Said , V.I. Ogurtsov , K. Twomey , L.C. Nagle , G. Herzog
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引用次数: 15

Abstract

Chemical modifications on recessed microelectrode array, achieved via electrodeposition techniques are reported here. Silicon-based gold microelectrode arrays of 10 μm microband and microdisc array were selected and functionalised using sol-gel and nanoporous gold (NPG) respectively. For electrochemically assisted self-assembly (EASA) formati6154on of sol-gel, electrode surface was first pre-treated with a self-assembled partial monolayer of mercaptopropyltrimethoxysilane (MPTMS) before transferring it into the sol containing cetyltrimethyl ammonium bromide (CTAB)/tetraethoxysilane (TEOS):MPTMS (90:10) precursors. A cathodic potential is then applied. It was found that larger current densities were required in ensuring successful film deposition when moving from macro- to micro- dimensions. For NPG modification, a chemical etching process called dealloying was employed. NPG of three different thicknesses have been successfully deposited. All the modified and functionalized microelectrode arrays were characterized by both optical (SEM) and electrochemical analysis (cyclic voltammetry and impedance spectroscopy). An increase in surface area and roughness has been observed and such will benefit for future sensing application.

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嵌入式微电极阵列的化学修饰电极
本文报道了通过电沉积技术对嵌入式微电极阵列进行化学修饰。选择10 μm微带硅基金微电极阵列和微盘阵列,分别用溶胶-凝胶和纳米孔金(NPG)进行功能化。对于溶胶-凝胶的电化学辅助自组装(EASA)形成6154on,首先用自组装的部分单层巯基丙基三甲氧基硅烷(MPTMS)对电极表面进行预处理,然后将其转移到含有十六烷基三甲基溴化铵(CTAB)/四乙氧基硅烷(TEOS):MPTMS(90:10)前驱体的溶胶中。然后施加阴极电位。研究发现,在从宏观到微观的过程中,为了保证薄膜的成功沉积,需要更大的电流密度。对于NPG的改性,采用一种称为脱合金的化学蚀刻工艺。成功沉积了三种不同厚度的NPG。所有修饰和功能化的微电极阵列都通过光学(SEM)和电化学(循环伏安法和阻抗谱)进行了表征。已经观察到表面积和粗糙度的增加,这将有利于未来的传感应用。
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