Cross-SSN analysis in multilayer printed circuit boards

G. Antonini, A. Scogna, A. Orlandi, V. Ricchiuti
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引用次数: 5

Abstract

As digital circuits became faster and more power is involved, direct coupling in multilayer printed circuit boards (PCBs) among power (PWR) planes becomes a major concern for signal integrity (SI) and electromagnetic interference (EMI). Aim of this paper is to show how an electromagnetic wave can propagate between planes and therefore induce noise on the signals crossing the planes' pairs through vias eventually radiate from the edge of the board. More specifically our study focuses on the analysis of the noise which propagates from a power plane to another power plane due to their proximity, named cross-simultaneous switching noise (X-SSN). This effect can be mitigated by a careful analysis of the location of PWR and ground (GND) planes in the board stack-up which avoid the contiguity of two PWR planes. A test board is built and measurements are performed. These measurements are also compared with three dimensional numerical results.
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多层印刷电路板的交叉ssn分析
随着数字电路的发展速度越来越快,涉及的功率越来越大,多层印刷电路板(pcb)中功率(PWR)平面之间的直接耦合成为信号完整性(SI)和电磁干扰(EMI)的主要问题。本文的目的是展示电磁波如何在平面之间传播,从而在穿过平面对的信号上产生噪声,通过通孔最终从板的边缘辐射出去。更具体地说,我们的研究侧重于分析从一个电源平面传播到另一个电源平面的噪声,称为交叉同步开关噪声(X-SSN)。这种影响可以通过仔细分析压水堆和地(GND)平面在电路板堆叠中的位置来减轻,从而避免两个压水堆平面的相邻。建立了测试板并进行了测量。这些测量结果还与三维数值结果进行了比较。
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