Kyoungsik Yu, Daesung Lee, U. Krishnamoorthy, N. Park, O. Solgaard
{"title":"Micromachined Fourier transform spectrometer on silicon optical bench platform","authors":"Kyoungsik Yu, Daesung Lee, U. Krishnamoorthy, N. Park, O. Solgaard","doi":"10.1109/SENSOR.2005.1497306","DOIUrl":null,"url":null,"abstract":"We present a miniaturized Fourier transform spectrometer implemented on a silicon optical bench platform. The optical and opto-mechanical components of a Michelson interferometer, such as a beam splitter, micromirrors, MEMS actuators, and fiber U-grooves, are simultaneously fabricated by micromachining of the device layer of a silicon-on-insulator wafer. Our bulk micromachining process combines the flexible definition capability of deep reactive ion etching with the good surface quality provided by anisotropic KOH wet-etching. A spectral resolution of 45 nm near 1550 nm wavelength is demonstrated.","PeriodicalId":22359,"journal":{"name":"The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.","volume":"93 1","pages":"1250-1254 Vol. 2"},"PeriodicalIF":0.0000,"publicationDate":"2005-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"98","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SENSOR.2005.1497306","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 98
Abstract
We present a miniaturized Fourier transform spectrometer implemented on a silicon optical bench platform. The optical and opto-mechanical components of a Michelson interferometer, such as a beam splitter, micromirrors, MEMS actuators, and fiber U-grooves, are simultaneously fabricated by micromachining of the device layer of a silicon-on-insulator wafer. Our bulk micromachining process combines the flexible definition capability of deep reactive ion etching with the good surface quality provided by anisotropic KOH wet-etching. A spectral resolution of 45 nm near 1550 nm wavelength is demonstrated.