Characterization of Plasma Etching of Molybdenum Polycid Conductor Stacks in Cl2/CF4 and Cl2/CF4/O2

R. Handke, G. Lippert
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Abstract

The present paper is concerned with an extremly anisotropic two-step patterning process for Mo2Si/poly-Si double layers with an etch-stop on thick P-doped CVD-SiO2. As etching gas Cl2/CF4/O2 and Cl2/CF4 are used. By means of etch rate dependencies, volatilities of possible reaction products and results, obtained from the literature it is attempted to develop a simple qualitative model on the chemism of the process. Der Artikel beschreibt einen auserst anisotropen plasmachemischen Zwei-Phasen-Strukturierungsprozes fur MoSi/poly-Si-Doppelschichten mit Atzstopp auf diekem P-dotiertem CVD-SiO2. Als Atzgase werden Cl2/CF4 und Cl2/CF4/O2 verwendet. Anhand von Atzratenabhangigkeiten, Fluchtigkeiten moglicher Reaktionsprodukte und Ergebnissen aus der Literatur wird versucht, ein einfaches qualitatives Modell zum Chemismus des Prozesses zu entwickeln.
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Cl2/CF4和Cl2/CF4/O2中钼聚酸导体堆的等离子体刻蚀特性
印刷文件是一个包含了mo2i /poly的极端动脉瘤a文,这是什麽?主要是从事抵押贷款交易,流行产品市场动荡带来的结果是:水痘出了水痘就变成了一个连接着污染化学的单纯的定性模型。本文描写了一个为期两阶段的MoSi/poly双相生成过程这是传统做法利用唾液和上色上色的上等货色和上等上等的上等货色
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