Self-timed thermal sensing and monitoring of multicore systems

Kameswar Rao Vaddina, E. Nigussie, P. Liljeberg, J. Plosila
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引用次数: 8

Abstract

As the number of cores increases thermal challenges increase, thereby degrading the performance and reliability of the system. We approach this challenge with a self-timed thermal monitoring method which is based on the use of thermal sensors. Since leakage currents are sensitive to temperature and increase with scaling, we propose the use of a leakage current based thermal sensing for monitoring purposes. In this work we have implemented a novel thermal sensing circuit in 65nm CMOS technology, which converts analog temperature information into digital form. We have also proposed a novel thermal sensing and monitoring interconnection network structure based on self-timed signaling, comprising of an encoder/transmitter and decoder/ receiver. We have performed power supply noise, additive noise on sensor input signal and dynamic power supply voltage variation analysis on the thermal sensing circuit and show that it is robust enough under different operating temperatures.
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多核系统的自定时热传感和监测
随着核心数量的增加,热挑战也随之增加,从而降低了系统的性能和可靠性。我们采用基于热传感器的自定时热监测方法来解决这一挑战。由于泄漏电流对温度很敏感,并且随着比例的增加而增加,我们建议使用基于泄漏电流的热感测来进行监测。在这项工作中,我们实现了一种新型的65纳米CMOS技术的热感测电路,它将模拟温度信息转换为数字形式。我们还提出了一种基于自定时信号的新型热传感和监测互连网络结构,该网络由编码器/发射器和解码器/接收器组成。我们对热敏电路进行了电源噪声、传感器输入信号的加性噪声和动态电源电压变化分析,表明它在不同的工作温度下具有足够的鲁棒性。
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