Copper single crystal PSB morphology between 4.2 and 350 K

Z.S. Basinski, S.J. Basinski
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引用次数: 43

Abstract

For fatigue at temperatures from 4.2 to 350 K, crystals in saturation comprise PSB and matrix regions, however, details of PSB morphology are temperature-dependent. There are three main types of profile. Type I: at very low temperatrures, mildly bulged PSBs comprising smooth extrusions. Type II: from ≈15 to ≈250 K, triangular bulges reaching > 10 μm in height. Type III: above 300 K, non-bulged PSBs comprising both intrusions and extrusions. Transition regions with PSBs of mixed character are found between the distinct types. Room temperature is near the end of a transition region, PSB morphology therefore depends on fatigue conditions. PSB profile development is independent of fatigue environment; crack propagation is environment dependent. There is no correlation betwen PSB morphology and point defect mobility.

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铜单晶PSB在4.2 ~ 350 K之间的形貌
在4.2至350 K的疲劳温度下,饱和晶体包括PSB和基体区域,然而,PSB形态的细节与温度有关。配置文件主要有三种类型。I型:在非常低的温度下,由光滑挤出物组成的轻度膨大的psb。II型:≈15 ~≈250k,三角形凸起达到>高度为10 μm。III型:300k以上,非膨出psb,包括侵入和挤压。在不同类型之间发现了具有混合特征的psb过渡区。室温接近过渡区的末端,因此PSB的形貌取决于疲劳条件。PSB型材的开发与疲劳环境无关;裂纹扩展与环境有关。PSB的形貌与点缺陷迁移率无相关性。
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