Equilibrium and kinetic studies of copper adsorption by activated carbon

Jiaping Chen, Sotira Yiacoumi, Timothy G. Blaydes
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引用次数: 65

Abstract

Copper adsorption by granular activated carbon is reported in this paper. The experimental section includes titrations of activated carbon, as well as equilibrium and kinetic studies of copper adsorption. The potentiometric titration results show that the point of zero charge is 9.5, and that the surface charge increases with decreasing pH. The adsorption of copper strongly depends on solution pH and increases from 10 to 95% at pH ranging from 2.3 to 8. A dramatic increase in pH and emission of small gas bubbles are observed during the experiments, which may result from adsorption of hydrogen ion and/or reduction-oxidation reactions. The two-pK triple-layer model is employed to describe copper adsorption. KINEQL, an adsorption kinetics algorithm, is used to represent the experimental data, and it is found that the model can describe reasonably well the experimental measurements of surface charge, adsorption equilibrium, and adsorption kinetics. Calculations show that formation of the surface-metal complexes SOCu2+ and SOCuOH+ (a hydrolysis product of SOCu 2+) in the outer layer around the surface of carbon results in removal of copper ion. It is also found that mass transfer controls the adsorption rate, and that adsorption occurs in the micropore region where both external mass transfer and diffusion are important.

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活性炭吸附铜的平衡及动力学研究
报道了颗粒活性炭对铜的吸附。实验部分包括活性炭的滴定,以及铜吸附的平衡和动力学研究。电位滴定结果表明,铜的零电荷点为9.5,表面电荷随pH的降低而增加。铜的吸附与pH有很强的关系,在pH为2.3 ~ 8的范围内,铜的吸附从10%增加到95%。在实验中观察到pH值的急剧增加和小气泡的排放,这可能是由于氢离子的吸附和/或还原氧化反应。采用两pk三层模型来描述铜的吸附。采用吸附动力学算法KINEQL表示实验数据,发现该模型能较好地描述表面电荷、吸附平衡和吸附动力学的实验测量结果。计算表明,在碳表面周围的外层形成了表面金属配合物SO−Cu2+和SO−CuOH+ (SO−Cu2+的水解产物),导致了铜离子的去除。还发现传质控制着吸附速率,吸附发生在外传质和扩散都很重要的微孔区域。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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