Polymer Inclusion Compounds

Lei Huang, A. Tonelli
{"title":"Polymer Inclusion Compounds","authors":"Lei Huang, A. Tonelli","doi":"10.1080/15583729808546037","DOIUrl":null,"url":null,"abstract":"1. INTRODUCTION 1.1. Background Schlenk was the first to use the term inclusion compound (IC) to describe the crystalline adducts in which one component (host molecule) crystallizes into a matrix, isolating the second component (guest molecule) into cavities of well-defined geometry [1]. Most of the ICs reported have been described as inclusion compounds or clathrates in the literature. In addition, there are many more compounds that are described as solvates, and many of these must surely be ICs [2].","PeriodicalId":16139,"journal":{"name":"Journal of Macromolecular Science-reviews in Macromolecular Chemistry and Physics","volume":"137 1","pages":"781-837"},"PeriodicalIF":0.0000,"publicationDate":"1998-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"45","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Macromolecular Science-reviews in Macromolecular Chemistry and Physics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1080/15583729808546037","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 45

Abstract

1. INTRODUCTION 1.1. Background Schlenk was the first to use the term inclusion compound (IC) to describe the crystalline adducts in which one component (host molecule) crystallizes into a matrix, isolating the second component (guest molecule) into cavities of well-defined geometry [1]. Most of the ICs reported have been described as inclusion compounds or clathrates in the literature. In addition, there are many more compounds that are described as solvates, and many of these must surely be ICs [2].
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聚合物包合物
1. 介绍1.1。Schlenk是第一个使用包合化合物(IC)一词来描述晶体加合物的人,其中一种成分(宿主分子)结晶成基质,将第二种成分(客体分子)分离成具有明确几何形状的空腔[1]。文献中所报道的大多数集成电路都被描述为包合物或包合物。此外,还有更多的化合物被描述为溶剂化物,其中许多肯定是ic[2]。
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