The growth and structure of RF sputtered indium tin oxide thin films

K. Sreenivas, Abhai Mansingh
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引用次数: 4

Abstract

Indium tin oxide films have been grown by reactively sputtering an indium/tin metallic alloy target in argon-oxygen mixtures. Growth parameters and annealing conditions have been optimized at low temperatures. Reactively sputtered oxide films were highly insulating and did require a post-deposition annealing treatment in a reducing ambient, to become highly transparent and conducting. A new annealing ambient, cracked ammonia, has been found to be very effective and economical. Films have been characterized for their structure and morphology by electron diffraction and scanning electron microscopy respectively. Relative advantages of annealing in cracked ammonia over nitrogen-hydrogen mixtures employed by other workers have been discussed. Films with preferred orientation, high optical transmission (∼ 95%) and low electrical resistivity (3 × 10−4 ω cm) have been obtained.

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射频溅射氧化铟锡薄膜的生长与结构
在氩氧混合物中,用反应溅射法制备了铟锡氧化物薄膜。在低温条件下对生长参数和退火条件进行了优化。反应性溅射氧化膜是高度绝缘的,需要在还原环境中进行沉积后退火处理,才能变得高度透明和导电。一种新的退火环境——裂解氨是一种经济有效的退火环境。用电子衍射和扫描电镜对膜的结构和形貌进行了表征。讨论了在裂解氨中退火与其他工人采用的氮氢混合物相比的相对优点。获得了具有择优取向、高透光率(~ 95%)和低电阻率(3 × 10−4 ω cm)的薄膜。
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