{"title":"Design of Circuits and Packaging Systems for Security Chips","authors":"M. Nagata","doi":"10.1587/transele.2022cdi0001","DOIUrl":null,"url":null,"abstract":"SUMMARY Hardware oriented security and trust of semiconductor integrated circuit (IC) chips have been highly demanded. This paper outlines the requirements and recent developments in circuits and packaging systems of IC chips for security applications, with the particular emphasis on protections against physical implementation attacks. Power side channels are of undesired presence to crypto circuits once a crypto algorithm is implemented in Silicon, over power delivery networks (PDNs) on the frontside of a chip or even through the backside of a Si substrate, in the form of power voltage variation and electromagnetic wave emanation. Pre-ventive measures have been exploited with circuit design and packaging technologies","PeriodicalId":13259,"journal":{"name":"IEICE Trans. Electron.","volume":"9 1","pages":"345-351"},"PeriodicalIF":0.0000,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEICE Trans. Electron.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1587/transele.2022cdi0001","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
SUMMARY Hardware oriented security and trust of semiconductor integrated circuit (IC) chips have been highly demanded. This paper outlines the requirements and recent developments in circuits and packaging systems of IC chips for security applications, with the particular emphasis on protections against physical implementation attacks. Power side channels are of undesired presence to crypto circuits once a crypto algorithm is implemented in Silicon, over power delivery networks (PDNs) on the frontside of a chip or even through the backside of a Si substrate, in the form of power voltage variation and electromagnetic wave emanation. Pre-ventive measures have been exploited with circuit design and packaging technologies