Fabrication of L10-MnAl thin films with high perpendicular magnetic anisotropy for STT-MRAM.

M. Parvin, M. Kubota, M. Oogane, M. Tsunoda, Y. Ando
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引用次数: 1

Abstract

Magnetic tunnel junctions with perpendicularly magnetized ferromagnetic materials $(p$-MTJs) have great potential to realize the ultra-high-density STT-MRAM. The switching current density $( J_{\mathrm{co}})$ in STT-MRAM is directly related to saturation magnetization $( M_{\mathrm{s}})$ and Gilbert damping constant $( \alpha )$ of the ferromagnetic free layer of MTJs [1]. In order to achieve high thermal stability and low switching current density in $p$-MTJs, ferromagnetic materials with large perpendicular magnetic anisotropy energy $( K_{\mathrm{u}})$, small $M_{\mathrm{s}}$ and low $\alpha $ are required. Here, we focus on a$L 1 _{0} -$MnAl alloy, which exhibits small $M_{s}$ and high $K_{u}$ [2, 3]. In our previous works, we obtained large $K_{u}$ in $L 1 _{0}$-MnAl films prepared at high substrate temperature [4]. However, high-substrate-temperature can cause increasing roughness of the films and atomic diffusion between the MnAl films and their buffer layers. In this work, we systematically investigated substrate and annealing temperature dependences of structural and magnetic properties in the MnAl thin films. The film stacking structure was MgO(001)-sub./CrRu(40)/MnAl(50)/Ta(5) (in nm). All the films were prepared by a magnetron sputtering system. The Mn-Al alloy target composition was Mn 46 Al 54.The substrate temperature $( T_{s})$ during deposition was varied from $200 ^{0}\mathrm {C}$ to $400 ^{0}\mathrm {C}$ and the post-annealing temperature $( T_{a})$ was varied from $200 ^{0}\mathrm {C}$ to $500 ^{0}\mathrm {C}$. The crystal structure of MnAl(50nm) films was investigated by an X-ray diffraction (XRD). The magnetic properties and surface morphology of the films were measured by superconductive quantum interference device (SQUID), vibrating sample magnetometer (VSM), and atomic force microscope (AFM). We confirmed that CrRu buffer layers had good structural property and very smooth surface morphology after annealing at $650 ^{\circ}\mathrm {C}$. Fig. 1showsXRD patterns of the films at $T_{s} \quad = 250 ^{\circ}\mathrm {C}$ with different annealing temperature. In the XRD patterns,(001) and (002) peaks of $L 1 _{0} -$MnAl were observed. This result indicates that both $L 1 _{0} -$ordered and (001)-oriented MnAl films were successfully fabricated. The peak intensity of $L 1 _{0}$-MnAl was improved with increasing both substrate and annealing temperature. However, surface roughness drastically increased above $T_{s} \quad = 300 ^{\circ}\mathrm {C}$. The annealing temperature dependence of magnetic properties was systematically investigated in MnAl films with $T_{s} \quad = 250 ^{\circ}\mathrm {C}$. A very high $K_{u}$ was obtained at $T_{a} \quad = 350 ^{\circ}\mathrm {C}$ as shown in $M-H$ curve in Fig. 2.We finally obtained a${L1}_{0}$-ordered MnAl film with high $K_{u}$ of 13.0 Merg/cc, relatively low $M_{s}$ of 497 emu/cc and small roughness $( R_{a})$ of 0.3 nm in the condition of $T_{s} = 250 ^{\circ}\mathrm {C}$ and $T_{a} = 350 ^{\circ}\mathrm {C}$. The optimized MnAl film will be greatly useful to realize the high-density STT-MRAM. This work was part of a research and development project for ICT key technology to realize future societies.
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STT-MRAM高垂直磁各向异性L10-MnAl薄膜的制备。
垂直磁化铁磁材料的磁隧道结具有实现超高密度STT-MRAM的巨大潜力。STT-MRAM中开关电流密度$(J_{\mathrm{co}})$与MTJs铁磁自由层的饱和磁化强度$(M_{\mathrm{s}})$和Gilbert阻尼常数$(\alpha)$直接相关[1]。为了在p -MTJs中实现高的热稳定性和低的开关电流密度,需要具有大的垂直磁各向异性能$(K_{\mathrm{u}})$、小$M_{\mathrm{s}}$和低$\alpha $的铁磁材料。本文重点研究了$ 1 _{0}-$MnAl合金,该合金具有较小的$M_{s}$和较高的$K_{u}$[2,3]。在我们之前的工作中,我们在高衬底温度下制备的$ l1_ {0}$-MnAl薄膜中获得了较大的$K_{u}$[4]。然而,较高的衬底温度会导致薄膜的粗糙度增加和MnAl薄膜及其缓冲层之间的原子扩散。在这项工作中,我们系统地研究了衬底和退火温度对MnAl薄膜结构和磁性能的依赖。膜层结构为MgO(001)-sub./CrRu(40)/MnAl(50)/Ta(5)(单位nm)。所有薄膜均采用磁控溅射系统制备。Mn-Al合金靶成分为Mn 46 Al 54。沉积过程中衬底温度$(T_{s})$从$200 ^{0}\ mathm {C}$变化到$400 ^{0}\ mathm {C}$,退火后温度$(T_{a})$从$200 ^{0}\ mathm {C}$变化到$500 ^{0}\ mathm {C}$。用x射线衍射(XRD)研究了50nm MnAl薄膜的晶体结构。利用超导量子干涉仪(SQUID)、振动样品磁强计(VSM)和原子力显微镜(AFM)测量了膜的磁性能和表面形貌。在$650 ^{\circ}\ mathm {C}$退火后,我们证实了CrRu缓冲层具有良好的结构性能和非常光滑的表面形貌。图1为薄膜在$T_{s} \quad = 250 ^{\circ}\ mathm {C}$处不同退火温度下的xrd谱图。在XRD谱图中,观察到$L 1 _{0} -$MnAl的(001)和(002)峰。结果表明,制备了$ 1 _{0}-$有序和(001)取向的MnAl薄膜。$L 1 _{0}$-MnAl的峰值强度随着衬底和退火温度的升高而增强。然而,当$T_{s} \quad = 300 ^{\circ}\ mathm {C}$时,表面粗糙度急剧增加。系统地研究了$T_{s} \quad = 250 ^{\circ}\ mathm {C}$的MnAl薄膜的磁性能随退火温度的变化规律。在$T_{A}\ quad = 350 ^{\circ}\ maththrm {C}$处获得了非常高的$K_{u}$,如图2的$M-H$曲线所示。在$T_{s} = 250 ^{\circ}\mathrm {C}$和$T_{a} = 350 ^{\circ}\mathrm {C}$的条件下,我们最终获得了${L1}_{0}$有序的MnAl薄膜,其$K_{u}$为13.0 Merg/cc, $M_{s}$为497 emu/cc,粗糙度$(R_{a})$为0.3 nm。优化后的MnAl薄膜对高密度STT-MRAM的实现具有重要意义。这项工作是实现未来社会的ICT关键技术研发项目的一部分。
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