Film deposition and annealing treatment of sputtered bismuth telluride based thin films

Y. Sasaki, K. Takayama, M. Takashiri
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引用次数: 2

Abstract

In an effort to fabricate thin film thermoelectric generators, we prepared p-type antimony telluride and n-type bismuth telluride thin films by using a RF magnetron sputtering, after which a thermal annealing was implemented. We investigated the relationship between the annealing temperatures and the properties of both types of the thin films. The structural properties were analyzed by x-ray diffraction patterns and scanning electron microscope. The in-plane electrical properties, which were the electrical conductivity, Seebeck coefficient and power factor, were estimated at room temperature. As a result, the surface morphology of both types of the thin films exhibited nano-sized pores as the annealing temperature increased possibly because of the evaporation of tellurium atoms. This evaporation also induced to increase the defect density of both types of the thin films, and to be degraded their electrical properties. Therefore, we resulted in the higher thermoelectric properties at the annealing temperature of 300 °C; antimony telluride:  S 2 = 18.8  W/(cm ∙ K 2 ) and bismuth telluride:  S 2 = 20.9  W/(cm
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溅射碲化铋基薄膜的沉积及退火处理
为了制造薄膜热电发生器,我们采用射频磁控溅射法制备了p型碲化锑和n型碲化铋薄膜,然后进行了热退火。我们研究了退火温度与两种薄膜性能之间的关系。用x射线衍射图和扫描电镜对其结构性质进行了分析。在室温下,对其电导率、塞贝克系数和功率因数进行了面内电学性能的估计。结果表明,随着退火温度的升高,两种薄膜的表面形貌都呈现出纳米尺度的孔隙,这可能是由于碲原子的蒸发造成的。这种蒸发也会导致两种类型薄膜的缺陷密度增加,并降低其电性能。因此,我们在300℃的退火温度下得到了更高的热电性能;碲化锑:s2 = 18.8W/(cm∙K 2);碲化铋:s2 = 20.9W/(cm
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