A Study of JEDEC Board-Level Drop Test Performance Prediction Trend of BGA Package with SAC1205 Under Different Key Factors

Abstract

With the rapid development of technology, the number and demand for handheld devices are increasing, and the new technology product development and launch are getting faster and faster. Also, handheld devices need to withstand various movements, fall-down situations, and even regular use in different temperature environments. Therefore, solder joint reliability is decidedly crucial for handheld devices. Moreover, how to seize the critical factors during the design development phase and fulfill market demands are also significant. According to the definition of JESD22-B111 [1], the drop test requires that the board should be horizontal with the package facing in the downward direction (-Z) during the experiment. Therefore, under the influence of the acceleration of gravity, the weight of the ball grid array(BGA) package, the number of balls, solder ball material, and the solder ball pad size in the drop test are recognized as important factors affecting the board-level reliability of the drop test. This study will explore these key factors and how they affect the board-level reliability of the drop test.