Electrochemical behaviour of Cu–Ni alloy in 3%NaCl medium polluted by sulphides: effect of aminotriazole

A. Laachach, A. Srhiri, C. Fiaud, A. Benbachir
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引用次数: 5

Abstract

Abstract The behaviour of 70/30 Cu–Ni alloy in 3%NaCl medium, both pure and contaminated by 1 ppm S2-ions, has been studied in the absence and in the presence of aminotriazole at a concentration of 10-4M. Potentiodynamic and electrochemical impedance measurements showed that sulphides accelerate the corrosion of the alloy in 3%NaCl. The aminotriazole inhibited both anodic and cathodic corrosion processes. The inhibiting effect was higher when the solution contained the S2-ions. Analysis by scanning electron microscopy (SEM) showed that the inhibitor acts by establishing a very thin film on the metal surface. This film behaves as a barrier to the diffusion of dissolved oxygen and to the transport of the metal ions from the melt to the solution.
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Cu-Ni合金在硫化物污染的3%NaCl介质中的电化学行为:氨基三唑的影响
摘要:研究了70/30 Cu-Ni合金在浓度为10-4M的氨基三唑存在和不存在的情况下在3%NaCl和1 ppm s2离子污染下的行为。电位学和电化学阻抗测试表明,硫化物加速了合金在3%NaCl中的腐蚀。氨三唑对阳极和阴极腐蚀均有抑制作用。当溶液中含有s2离子时,抑制效果较好。扫描电镜(SEM)分析表明,该抑制剂通过在金属表面形成一层非常薄的膜来起作用。这层膜的作用是阻止溶解氧的扩散和金属离子从熔体向溶液的转移。
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