Design, Automation, and Test for Low-Power and Reliable Flexible Electronics

Tsung-Ching Huang, Jiun-Lang Huang, K. Cheng
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引用次数: 11

Abstract

Flexible electronics are emerging as an alternative to conventional Si electronics for large-area low-cost applications such as smart sensors, disposable RFID tags, and solar cells. By utilizing inexpensive manufacturing methods such as ink-jet printing and roll-to-roll imprinting, flexible electronics can be made on low-cost plastic films just like printing newspapers. However, the key elements of flexible electronics, thin-film transistors TFTs, have slower operating speeds and are less reliable than their Si electronics counterparts. Furthermore, depending on the material property, TFTs are usually mono-type - either p- or n-type - devices. Making air-stable complementary TFT circuits is very challenging or not applicable to most TFT technologies. Existing design methodologies for Si electronics, therefore, cannot be directly applied to flexible electronics. Other inhibiting factors such as high supply voltage, large process variation, and lack of trustworthy device modeling also make designing larger-scale and robust TFT circuits a challenge.The objective of this article is to provide an in-depth overview of flexible electronics from their applications, manufacturing processes, device characteristics, to circuit and system design solutions. We first introduce the low-cost fabrication methods for flexible electronics, including ink-jet printing, screen printing, and gravure printing. The device characteristics and compact modeling of four major types of TFT technologies, including hydrogenated amorphous silicon a-Si:H TFT, polymer organic TFT, self-assembly monolayer SAM organic TFT, and metal oxide TFT, will be illustrated. We will then give an overview of digital and analog circuit design from basic logic gates to a microprocessor, as well as design automation tools and methods, for designing flexible electronics. In order to accurately predict the time-dependent degradation of TFT circuits, we describe a reliability simulation framework that can predict the TFT circuits' performance degradation under bias-stress. This framework has been validated using the amorphous-silicon a-Si TFT scan driver for TFT-LCD displays. Finally, we will give an overview of flexible thin-film photovoltaics using different materials including amorphous silicon, CdTe, CIGS , and organic solar cells.
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低功耗、可靠柔性电子器件的设计、自动化和测试
柔性电子产品正在成为传统硅电子产品的替代品,用于大面积低成本应用,如智能传感器、一次性RFID标签和太阳能电池。通过使用廉价的制造方法,如喷墨印刷和卷对卷压印,柔性电子产品可以像印刷报纸一样在低成本的塑料薄膜上制造。然而,柔性电子器件的关键元素,薄膜晶体管tft,其运行速度较慢,可靠性不如硅电子器件。此外,根据材料的性质,tft通常是单型- p型或n型-器件。制造空气稳定互补TFT电路是非常具有挑战性的,或者不适用于大多数TFT技术。因此,硅电子的现有设计方法不能直接应用于柔性电子。其他抑制因素,如高电源电压、大工艺变化和缺乏可靠的器件建模,也使得设计更大规模和鲁棒的TFT电路成为一项挑战。本文的目的是从其应用、制造工艺、器件特性、电路和系统设计解决方案等方面对柔性电子产品进行深入概述。我们首先介绍了柔性电子器件的低成本制造方法,包括喷墨印刷、丝网印刷和凹版印刷。四种主要类型的TFT技术,包括氢化非晶硅a-Si:H TFT,聚合物有机TFT,自组装单层SAM有机TFT和金属氧化物TFT的器件特性和紧凑建模,将被说明。然后,我们将概述从基本逻辑门到微处理器的数字和模拟电路设计,以及设计自动化工具和方法,用于设计柔性电子器件。为了准确地预测TFT电路的时间相关退化,我们描述了一个可靠性仿真框架,可以预测TFT电路在偏置应力下的性能退化。该框架已使用非晶硅a-Si TFT扫描驱动器进行了TFT- lcd显示器的验证。最后,我们将概述使用不同材料的柔性薄膜光伏电池,包括非晶硅,CdTe, CIGS和有机太阳能电池。
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Foundations and Trends in Electronic Design Automation
Foundations and Trends in Electronic Design Automation ENGINEERING, ELECTRICAL & ELECTRONIC-
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期刊介绍: Foundations and Trends® in Electronic Design Automation publishes survey and tutorial articles in the following topics: - System Level Design - Behavioral Synthesis - Logic Design - Verification - Test - Physical Design - Circuit Level Design - Reconfigurable Systems - Analog Design Each issue of Foundations and Trends® in Electronic Design Automation comprises a 50-100 page monograph written by research leaders in the field.
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