Electrical Conductivity and Surface Roughness Properties of Ferroelectric Gallium Doped Ba0,5Sr0,5TiO3 (BGST) Thin Films

I. Irzaman, A. Marwan, A. Arief, R. Hamdani, M. Komaro
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引用次数: 2

Abstract

Ba0.5Sr0.5TiO3 (BST) and gallium doped BST (BGST) thin films were successfully deposited on p-type Si(100) substrates. The thin films were fabricated by the chemical solution deposition (CSD) and spin coating method, with 1.00 M precursor and spinning speed of 3000 rpm for 30 seconds. The post deposition annealing of the 9 films were carried out BST without gallium (BGST 0%) annealing 850OC, BGST 0% annealing 900OC, BGST 0% annealing 950oC, BGST 5% annealing 850oC, BGST 5% annealing 900oC, BGST 5% annealing 950oC, BGST 10% annealing 850oC, BGST 10% annealing 900oC, BGST 10% annealing 950oC for 15 hour in oxygen gas atmosphere, respectively. The resistance and electrical conductivity of the grown thin films are characterized by I-V converter, meanwhile surface roughness of the grown thin films are characterized by atomic force microscopy (AFM) method. The electrical conductivity of the grown thin films BGST due to semiconductor. The results show that resistance and electrical conductivity of the thin film have strong correlation to the annealing temperature, concentration dopant and surface roughness.
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铁电镓掺杂Ba0,5Sr0,5TiO3 (BGST)薄膜的电导率和表面粗糙度
在p型Si(100)衬底上成功地沉积了Ba0.5Sr0.5TiO3 (BST)和掺镓BST (BGST)薄膜。采用化学溶液沉积(CSD)和自旋镀膜的方法制备薄膜,采用1.00 M的前驱体,旋转速度为3000 rpm,旋转30秒。9种薄膜的沉积后退火分别为无镓(BGST 0%)退火850OC、BGST 0%退火900OC、BGST 0%退火950oC、BGST 5%退火850OC、BGST 5%退火900OC、BGST 5%退火950oC、BGST 10%退火850OC、BGST 10%退火900OC、BGST 10%退火950oC,在氧气气氛中退火15h。用I-V变换器对生长薄膜的电阻和电导率进行了表征,同时用原子力显微镜(AFM)方法对生长薄膜的表面粗糙度进行了表征。半导体作用下生长的BGST薄膜的导电性。结果表明,薄膜的电阻和电导率与退火温度、掺杂浓度和表面粗糙度有很强的相关性。
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