Express X-ray fluorescent analysis of technical-grade tantalum and niobium: from raw materials to products

L. Y. Mezhevaya, M. N. Filippov, O. I. Lyamina, G. E. Mar’ina, A. Arkhipenko, V. B. Baranovskaya
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Abstract

Determination of impurities in Ta- and Nb-based materials is a necessary operation in supporting technological processes. The existing approaches involve the transfer of a sample into a solution with subsequent isolation of impurities. This procedure is rather complicated and takes a lot of time. For this reason, it is of interest to study the possibilities of direct analysis of solid-phase samples of materials, e.g., X-ray fluorescence analysis (XRF). The usual scheme of X-ray fluorescence analysis, which involves the experimental construction of calibration characteristics for each element to be determined, requires using a large number of reference samples containing a rather wide range of impurities. We present the results of preliminary characterization of samples of technical-grade tantalum and niobium and products on their base. It is shown that for starting materials, only a significant absence of impurities can be determined using XPA, but even for sintered niobium hydride and Ta powder, XPA can be used as a method for rapid assessment of the composition. A SPECTROSCAN MAX GVM crystal-diffraction spectrometer can be used for analysis and a standard software that implements the fundamental parameter method (FPA) can be used for calibration. In this case, the obtained values of the content of impurities may differ by 1 – 2 orders of magnitude from the reference values. However, such an accuracy is often enough to correct technological processes. The limits of detecting impurities by XRF in Ta- and Nb-based materials are revealed: for elements determined by K-series (from Ti to Co), the detection limits lie in the range from 30 to 60 ppm, whereas for the elements determined by M-series (Ta) the detection limit is approximately 200 ppm and for L-series (Nb) the detection limit is in the range from 100 to 150 ppm.
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技术级钽和铌的快速x射线荧光分析:从原料到产品
钽基和铌基材料中杂质的测定是配套工艺过程中必要的操作。现有的方法包括将样品转移到溶液中,随后分离杂质。这个程序相当复杂,需要花费很多时间。因此,研究直接分析材料固相样品的可能性,例如x射线荧光分析(XRF)是很有意义的。通常的x射线荧光分析方案涉及到对每个待测定元素的校准特性进行实验构建,需要使用含有相当大范围杂质的大量参考样品。我们提出了技术级钽和铌样品及其基础产品的初步表征结果。结果表明,对于起始材料,XPA只能测定其明显不含杂质,但即使对于烧结的氢化铌和Ta粉,XPA也可以作为一种快速评估成分的方法。可使用SPECTROSCAN MAX GVM晶体衍射光谱仪进行分析,并可使用实现基本参数法(FPA)的标准软件进行校准。在这种情况下,所得的杂质含量值可能与参考值相差1 - 2个数量级。然而,这样的精度往往足以纠正技术过程。揭示了用XRF检测Ta基和Nb基材料中杂质的限限:对于k系列(从Ti到Co)测定的元素,检测限在30 ~ 60ppm范围内,而对于m系列(Ta)测定的元素,检测限约为200ppm,对于l系列(Nb),检测限在100 ~ 150ppm范围内。
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