Research on Novel Thermal Insulation Structure of CMOS-MEMS Thermopile

IF 1.3 Q3 COMPUTER SCIENCE, INFORMATION SYSTEMS IET Networks Pub Date : 2022-10-14 DOI:10.1109/IET-ICETA56553.2022.9971595
Kai-Chung Yu, Chih-Hsiung Shen
{"title":"Research on Novel Thermal Insulation Structure of CMOS-MEMS Thermopile","authors":"Kai-Chung Yu, Chih-Hsiung Shen","doi":"10.1109/IET-ICETA56553.2022.9971595","DOIUrl":null,"url":null,"abstract":"In this research, we discuss and analyze the thermal insulation microstructure which appropriately reduce the thermal conductivity and form a local channel where the heat flow is concentrated. As the channel becomes smaller, the thermal resistance increases and the noise will also increase. For the Johnson noise, the bandwidth can be reduced through subsequent electronic circuit signal processing. Although the response speed is sacrificed, the overall thermal sensing signal is improved in practical applications without introducing additional noise.","PeriodicalId":46240,"journal":{"name":"IET Networks","volume":"1 1","pages":"1-2"},"PeriodicalIF":1.3000,"publicationDate":"2022-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IET Networks","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IET-ICETA56553.2022.9971595","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"COMPUTER SCIENCE, INFORMATION SYSTEMS","Score":null,"Total":0}
引用次数: 0

Abstract

In this research, we discuss and analyze the thermal insulation microstructure which appropriately reduce the thermal conductivity and form a local channel where the heat flow is concentrated. As the channel becomes smaller, the thermal resistance increases and the noise will also increase. For the Johnson noise, the bandwidth can be reduced through subsequent electronic circuit signal processing. Although the response speed is sacrificed, the overall thermal sensing signal is improved in practical applications without introducing additional noise.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
CMOS-MEMS热电堆新型保温结构研究
在本研究中,我们讨论和分析了适当降低导热系数并形成热流集中的局部通道的隔热微观结构。随着通道变小,热阻增大,噪声也随之增大。对于约翰逊噪声,可以通过后续的电子电路信号处理来降低带宽。虽然牺牲了响应速度,但在实际应用中,在不引入额外噪声的情况下,整体热传感信号得到了改善。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
IET Networks
IET Networks COMPUTER SCIENCE, INFORMATION SYSTEMS-
CiteScore
5.00
自引率
0.00%
发文量
41
审稿时长
33 weeks
期刊介绍: IET Networks covers the fundamental developments and advancing methodologies to achieve higher performance, optimized and dependable future networks. IET Networks is particularly interested in new ideas and superior solutions to the known and arising technological development bottlenecks at all levels of networking such as topologies, protocols, routing, relaying and resource-allocation for more efficient and more reliable provision of network services. Topics include, but are not limited to: Network Architecture, Design and Planning, Network Protocol, Software, Analysis, Simulation and Experiment, Network Technologies, Applications and Services, Network Security, Operation and Management.
期刊最新文献
Smart forest monitoring: A novel Internet of Things framework with shortest path routing for sustainable environmental management Analysing the performance of AODV, OLSR, and DSDV routing protocols in VANET based on the ECIE method An unsupervised approach for the detection of zero-day distributed denial of service attacks in Internet of Things networks An effective ensemble electricity theft detection algorithm for smart grid Hard-state Protocol Independent Multicast—Source-Specific Multicast (HPIM-SSM)
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1