Diffusion of silver in nanocrystalline copper between 303 and 373 K

S Schumacher, R Birringer, R Strauβ, H Gleiter
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引用次数: 111

Abstract

The diffusion of silver in nanocrystalline copper was measured at various temperatures between 303 and 373 K. The specimens used were disc shaped pellets of nanocrystalline copper (average crystal size 8 nm). The silver was diffused in from one of the flat surfaces. The resulting silver concentration profile was determined by electron beam microanalysis on taper sectioned specimens. The values of the silver diffusion coefficients range from 0.3 · 10−18m2/s at 303 K to 12 · 10−18m2/sat 373 K. The activation enthalpies deduced were 0.63 eV (for T > 353 K) and 0.39 eV (for T < 343 K).

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银在纳米晶铜中在303 ~ 373 K间的扩散
在303 ~ 373 K的不同温度下,测量了银在纳米铜中的扩散。所使用的样品是纳米铜的圆盘状颗粒(平均晶体尺寸为8纳米)。银是从其中一个平面上扩散进来的。用电子束显微分析方法测定了锥形切片样品的银浓度分布图。银的扩散系数在303 K时为0.3·10−18m2/s,在373 K时为12·10−18m2/s。得到的活化焓为0.63 eV (T >353 K)和0.39 eV(用于T <343 K)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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