{"title":"Ultrasonic dispersion of nanocomposite solder for microelectronic packaging","authors":"S. Rajendran, Hyejun Kang, SeongMin Seo, J. Jung","doi":"10.1109/IMPACT56280.2022.9966718","DOIUrl":null,"url":null,"abstract":"With the progress in miniaturization and portability of consumer electronics, devices are expected to be compact and lightweight, demanding more input-output electrical transfer in less space via fine-pitch interconnections. The solder ball diameter used in the ball grid array (BGA) and Flip-chip ball grid array (FCBGA) for joining the integrated circuits, microprocessors, memory chips, etc., to printed circuit boards (PCB) is continuously downsized to meet the current market demands [1, 2].","PeriodicalId":13517,"journal":{"name":"Impact","volume":"15 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2022-10-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Impact","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMPACT56280.2022.9966718","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
With the progress in miniaturization and portability of consumer electronics, devices are expected to be compact and lightweight, demanding more input-output electrical transfer in less space via fine-pitch interconnections. The solder ball diameter used in the ball grid array (BGA) and Flip-chip ball grid array (FCBGA) for joining the integrated circuits, microprocessors, memory chips, etc., to printed circuit boards (PCB) is continuously downsized to meet the current market demands [1, 2].
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