{"title":"Direct bonding: retrospect and outlook","authors":"Jan Haisma","doi":"10.1016/0165-5817(95)82010-8","DOIUrl":null,"url":null,"abstract":"<div><p>The characteristic features of direct bonding with respect to its many-sided aspects are briefly enumerated. Nowadays silicon-on-silicon and silicon-on-insulator are the trendsetters. The preparative conditions of direct bonding are compatible with silicon technologies. In addition, in the future, direct bonding may find dedicated applications in the field of hybrid material combinations, micromechanics for precision medical tools, sensors and actuators.</p></div>","PeriodicalId":101018,"journal":{"name":"Philips Journal of Research","volume":"49 1","pages":"Pages 171-177"},"PeriodicalIF":0.0000,"publicationDate":"1995-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/0165-5817(95)82010-8","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Philips Journal of Research","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/0165581795820108","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
The characteristic features of direct bonding with respect to its many-sided aspects are briefly enumerated. Nowadays silicon-on-silicon and silicon-on-insulator are the trendsetters. The preparative conditions of direct bonding are compatible with silicon technologies. In addition, in the future, direct bonding may find dedicated applications in the field of hybrid material combinations, micromechanics for precision medical tools, sensors and actuators.
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