Robust and Accurate Measurement Methodology for High-speed Channel Electrical Characterization

Fred Chou, Alex Wei, Johnny Hsieh, Adolph Cheng, J. Hsu
{"title":"Robust and Accurate Measurement Methodology for High-speed Channel Electrical Characterization","authors":"Fred Chou, Alex Wei, Johnny Hsieh, Adolph Cheng, J. Hsu","doi":"10.1109/IMPACT56280.2022.9966699","DOIUrl":null,"url":null,"abstract":"As communication technology transits to 5G generation, it drives the development of AI ecology, such as new smart factories, smart warehousing, smart real-time monitoring platforms and other applications, which also tests the quality detection capability of high-speed channels in the data center printed circuit board(PCB), such as the loss of high-speed channels capability of measurement and impedance measurement and segmental analysis. The PCB manufacturers usually check the impedance by time-domain reflectometer (TDR) and channel loss of the PCB by vector network analyzer(VNA) according to the IPC standards [1] [2]. It is critical to have multi-zone analysis ability of the TDR impedance profile in the design and manufacture accurate perspective, such as how to identify correctly break out with the narrow trace routing, plating through hole (PTH) via and main routing impedance. In this paper, VNA with the calibration technology is proposed to not only analyze TDR impedance with multi-zones but also measure channel loss for quality risk assessment. The precision coaxial air lines are adopted as primary reference standards to assure impedance measurement verification, and traceability mechanism is conducted into the comparison experimental of impedance compensation capabilities for accurate and robust measurement. [3–5]","PeriodicalId":13517,"journal":{"name":"Impact","volume":"16 1","pages":"1-3"},"PeriodicalIF":0.0000,"publicationDate":"2022-10-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Impact","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMPACT56280.2022.9966699","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

As communication technology transits to 5G generation, it drives the development of AI ecology, such as new smart factories, smart warehousing, smart real-time monitoring platforms and other applications, which also tests the quality detection capability of high-speed channels in the data center printed circuit board(PCB), such as the loss of high-speed channels capability of measurement and impedance measurement and segmental analysis. The PCB manufacturers usually check the impedance by time-domain reflectometer (TDR) and channel loss of the PCB by vector network analyzer(VNA) according to the IPC standards [1] [2]. It is critical to have multi-zone analysis ability of the TDR impedance profile in the design and manufacture accurate perspective, such as how to identify correctly break out with the narrow trace routing, plating through hole (PTH) via and main routing impedance. In this paper, VNA with the calibration technology is proposed to not only analyze TDR impedance with multi-zones but also measure channel loss for quality risk assessment. The precision coaxial air lines are adopted as primary reference standards to assure impedance measurement verification, and traceability mechanism is conducted into the comparison experimental of impedance compensation capabilities for accurate and robust measurement. [3–5]
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
高速通道电特性的鲁棒和精确测量方法
随着通信技术向5G代过渡,带动AI生态的发展,如新型智能工厂、智能仓储、智能实时监控平台等应用,同时也考验着数据中心印刷电路板(PCB)高速通道的质量检测能力,如损耗高速通道的测量和阻抗测量及分段分析能力。PCB厂商通常根据IPC标准[1][2]用时域反射计(TDR)检测阻抗,用矢量网络分析仪(VNA)检测PCB的信道损耗。如何正确识别窄道走线、镀通孔(PTH)通孔和主走线阻抗的爆发,对TDR阻抗曲线的多区分析能力在设计和制造的准确角度至关重要。本文提出了带校准技术的VNA,不仅可以分析多区域的TDR阻抗,还可以测量信道损耗,进行质量风险评估。采用精密同轴导线作为主要参考标准,保证阻抗测量验证,并采用溯源机制进行阻抗补偿能力对比实验,保证测量的准确性和鲁棒性。(3 - 5)
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Systematising clustering techniques through cross-disciplinary research, leading to the development of new methods Overview of the research work of Dr. Hui-Ping Chuang Scaling up innovation: European Innovation Council Research on optical computing system architecture for simple recurrent neural networks Next-generation healthcare infrastructure based on cross-layer optimization of biosignal sensing and communication
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1