T. Nakao, M. Kadota, K. Nishiyama, Y. Nakai, D. Yamamoto, Y. Ishiura, T. Komura, N. Takada, R. Kita
{"title":"P2H-5 Small 3x2.5mm² Sized Surface Acoustic Wave Duplexer for US-PCS with Excellent Temperature and Frequency Characteristics","authors":"T. Nakao, M. Kadota, K. Nishiyama, Y. Nakai, D. Yamamoto, Y. Ishiura, T. Komura, N. Takada, R. Kita","doi":"10.1109/ULTSYM.2007.423","DOIUrl":null,"url":null,"abstract":"Using flattened-SiO<sub>2</sub>/Cu-electrode/36~48deg LiTaO<sub>3</sub> structure, small size (5 x5mm<sup>2</sup>) surface acoustic wave (SAW) duplexer with a good temperature coefficient of frequency (TCF) for US-PCS was realized by authors. However, a smaller duplexer has been strongly required. Using flip-chip bonding process of SAW chips and Rayleigh SAW propagating on the flattened-SiO<sub>2</sub>/Cu- electrode/126~128degYX-LiNbO<sub>3</sub>, which has larger cou pling factor than above-mentioned substrate, a smaller sized (3x2.5mm<sup>2</sup>) SAW duplexer with a good TCF has been realized.","PeriodicalId":6355,"journal":{"name":"2007 IEEE Ultrasonics Symposium Proceedings","volume":"64 1","pages":"1681-1684"},"PeriodicalIF":0.0000,"publicationDate":"2007-12-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE Ultrasonics Symposium Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ULTSYM.2007.423","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
Using flattened-SiO2/Cu-electrode/36~48deg LiTaO3 structure, small size (5 x5mm2) surface acoustic wave (SAW) duplexer with a good temperature coefficient of frequency (TCF) for US-PCS was realized by authors. However, a smaller duplexer has been strongly required. Using flip-chip bonding process of SAW chips and Rayleigh SAW propagating on the flattened-SiO2/Cu- electrode/126~128degYX-LiNbO3, which has larger cou pling factor than above-mentioned substrate, a smaller sized (3x2.5mm2) SAW duplexer with a good TCF has been realized.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
