Smart modular reconfigurable fully-digital manufacturing system with a knowledge-based framework: example of a fabrication of microfluidic chips

S. Scholz, A. Elkaseer, Tobias Muller, U. Gengenbach, V. Hagenmeyer
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引用次数: 5

Abstract

This paper presents an innovative approach to the development of a smart fully-digital manufacturing system based on a modular and reconfigurable production concept. In particular, multiple “plug and play” manufacturing modules, i.e. functional printing, laser processing and welding, in addition to a positioning control unit and quality inspection system, are exploited in an agile manufacturing platform combined with a knowledge-based framework, termed “3D-I”. This enables the production of tailored laminated parts, made up of stacks of functionalised layers of polymer films, with intricate 3D micro features. However, since no tool or mask making is needed, a medium to small lot-size and even one-off parts can be produced in a cost-effective manner. For the evaluation of the “3D-I” approach, a case study of micro-fluidic chips, exemplifying functional parts, are fabricated. The results prove the feasibility of the developed smart system to produce micro-devices with pre-defined specifications. In addition, the knowledge-based manufacturing system demonstrates its potential to offer profitable production scenarios of microdevices, with high flexibility and scalability, outside the area of mass production.
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智能模块化可重构全数字化制造系统与基于知识的框架:微流控芯片制造的例子
本文提出了一种基于模块化和可重构生产概念的智能全数字化制造系统开发的创新方法。特别是,多个“即插即用”制造模块,即功能打印、激光加工和焊接,以及定位控制单元和质量检测系统,在一个敏捷制造平台中被开发,并结合了一个基于知识的框架,称为“3D-I”。这使得生产定制的层压部件成为可能,这些部件由聚合物薄膜的功能化层堆叠而成,具有复杂的3D微特征。然而,由于不需要工具或掩模制作,因此可以以具有成本效益的方式生产中小批量甚至一次性零件。为了评估“3D-I”方法,制作了一个微流控芯片的案例研究,举例说明了功能部件。结果证明了所开发的智能系统生产具有预定规格的微型器件的可行性。此外,以知识为基础的制造系统展示了其在大规模生产领域之外提供具有高度灵活性和可扩展性的微型设备的盈利生产方案的潜力。
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