Additive Manufacturing of Cooling Systems Used in Power Electronics. A Brief Survey

Abstract

The power density of electronic devices continues to increase. While they are getting smaller, the amount of heat they generate is dramatically increasing. If using conventional cooling systems (heatsinks, heat pipes or various heat exchangers), their size and mass must be increased beyond limits, which is unacceptable especially in mobile applications (such as electric traction, aircraft industry, etc.). Therefore, new materials and fabrication technologies are urgently needed. Additive manufacturing, a revolutionary fabrication method, could be the key to these highly anticipated developments. This novel technology is perfectly fitted to the small-scale fabrication of specifically customized cooling systems. In this paper, the possibility of applying these new technologies to several cooling systems using enhanced thermally conductive materials is surveyed. At the same time, the main advantages brought about by this technological advance are highlighted.