{"title":"Impact of Quad Flat No Lead package (QFN) on automated X-ray inspection (AXI)","authors":"Tee Chwee Liong, Andy Pascual","doi":"10.1109/TEST.2007.4437601","DOIUrl":null,"url":null,"abstract":"QFN is increasingly being used on wireless cards, handhelds etc. However, QFN unique solder joints pose great challenges for AXI. This paper discusses lack of industry specification for QFN inspection, how AXI methodology was improved to detect QFN solder joint defect, design for inspection and future work.","PeriodicalId":6403,"journal":{"name":"2007 IEEE International Test Conference","volume":"35 1","pages":"1-10"},"PeriodicalIF":0.0000,"publicationDate":"2007-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE International Test Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TEST.2007.4437601","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
QFN is increasingly being used on wireless cards, handhelds etc. However, QFN unique solder joints pose great challenges for AXI. This paper discusses lack of industry specification for QFN inspection, how AXI methodology was improved to detect QFN solder joint defect, design for inspection and future work.
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