Heat Pipe System as a Component of Spacecraft Electronics

Abstract

We report on the results of optimizing a single flat heat pipe into an arrangement of heat pipes. A comparison is drawn at the same temperatures and occupied volumes and for a specific maximum temperature of radio-electronic devices. The end result of our studies is that the limiting heat transfer capacity has been found for a single heat pipe and two- and three-level heat pipe assemblies with various heat transfer media. Versatility of the mathematical model enhanced by the optimization method has been proved