Challenges in the Fabrication of a Glued III-V on Si Tandem Solar Cell Using a ZnO-Based TCA

U. Heitmann, J. Bartsch, S. Kluska, Nima Huschmand, Jana Wulf, D. Lackner, F. Dimroth, S. Janz
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引用次数: 1

Abstract

On the route to a high efficiency glued tandem solar cell fabricated using a ZnO-based transparent conductive adhesive, several challenges were encountered. By lowering the pressure during the annealing of the adhesive to 0.3 or 1 kg/cm2, the III-V surface did not crack and only minor delamination along the samples edge was observed. A fabricated tandem solar cell showed limitations due to voids within the bond (low fill factor) and a low current density due to a missing anti-reflective coating and reflectance at the bond layer. A sputtered TiO2:Nb contact layer showed a low ohmic contact on p-GaAs and thereby is suitable for implementation at the bond/III-V interface, which would significantly lower the reflectance at the bond.
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用zno基TCA制备III-V - Si串联太阳能电池的挑战
在采用zno基透明导电粘合剂制备高效胶合串联太阳能电池的过程中,遇到了一些挑战。将胶粘剂退火过程中的压力降低到0.3或1 kg/cm2, III-V表面没有开裂,只观察到沿样品边缘的轻微分层。制造的串联太阳能电池由于键内的空隙(低填充因子)和由于缺少抗反射涂层和键层的反射率而导致的低电流密度而显示出局限性。溅射后的TiO2:Nb接触层在p-GaAs上具有低欧姆接触,适合在键/III-V界面实现,可以显著降低键处的反射率。
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