CuO-based materials for thermochemical redox cycles: the influence of the formation of a CuO percolation network on oxygen release and oxidation kinetics.

Discover chemical engineering Pub Date : 2022-01-01 Epub Date: 2022-10-26 DOI:10.1007/s43938-022-00013-2
Qasim Imtiaz, Andac Armutlulu, Felix Donat, Christoph Müller
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Abstract

Thermochemical redox cycles such as chemical looping combustion (CLC) are an economically promising CO2 capture technology that rely on the combustion of a hydrocarbon fuel with lattice oxygen that is derived from a solid oxygen carrier. The oxygen carrier is typically regenerated with air. To increase the agglomeration resistance and redox stability of the oxygen carriers, the active phase is often stabilized with high Tammann temperature ceramics, resulting in the formation of so-called cermet structures. It has been hypothesized that the redox performance of the cermets depends critically on the conduction pathways for solid-state ionic diffusion and the activation energy for charge transport. Here, we investigate the influence of the formation of a percolation network on the electrical conductivity and the rate of oxidation for CeO2-stabilized Cu. We found that for oxygen carriers that contained 60 wt. % CuO, the charge transport occurred predominately via Cu/CuO conduction pathways. Below the percolation threshold of CuO, the conduction of charge carriers took place via CeO2 grains, which formed a continuous network. The measurements of charge transport and redox characteristics confirmed that the activation energy for charge transport through the cermet increased with decreasing Cu content. This indicates that the solid-state diffusion of charge carriers plays an important role during re-oxidation.

Supplementary information: The online version contains supplementary material available at 10.1007/s43938-022-00013-2.

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用于热化学氧化还原循环的CuO基材料:CuO渗透网络的形成对氧释放和氧化动力学的影响
热化学氧化还原循环,如化学循环燃烧(CLC)是一种经济上有前途的CO2捕获技术,其依赖于碳氢化合物燃料与源自固体氧载体的晶格氧的燃烧。氧气载体通常用空气再生。为了提高氧载体的抗团聚性和氧化还原稳定性,活性相通常用高塔曼温度陶瓷稳定,从而形成所谓的金属陶瓷结构。据推测,金属陶瓷的氧化还原性能主要取决于固态离子扩散的传导途径和电荷传输的活化能。在这里,我们研究了渗流网络的形成对CeO2稳定的Cu的电导率和氧化速率的影响。我们发现,对于含有60wt.%CuO的氧载体,电荷传输主要通过Cu/CuO传导途径发生。在CuO的渗滤阈值以下,电荷载流子通过CeO2晶粒进行传导,形成连续的网络。电荷传输和氧化还原特性的测量证实,通过金属陶瓷的电荷传输的活化能随着Cu含量的降低而增加。这表明电荷载流子的固态扩散在再氧化过程中起着重要作用。补充信息:在线版本包含补充材料,可访问10.1007/s43938-022-00013-2。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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