Effects of thermal cycling on bonding properties of novel low-shrinkage resin adhesive.

Q3 Medicine 华西口腔医学杂志 Pub Date : 2023-06-01 DOI:10.7518/hxkq.2023.2022459
Zonghua Wang, Xiaoran Zhang, Shuo Yao, Jiaxin Zhao, Chuanjian Zhou, Junling Wu
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引用次数: 0

Abstract

Objectives: The current study aimed to investigate the bonding properties of a novel low-shrinkage resin adhesive containing expanding monomer and epoxy resin monomer after thermal cycling aging treatment.

Methods: Expanding monomer of 3,9-diethyl-3,9-dimethylol-1,5,7,11-tetraoxaspiro-[5,5] undecane (DDTU) as an anti-shrinkage additive and unsaturated epoxy monomer of diallyl bisphenol A diglycidyl ether (DBDE) as a coupling agent were synthesized. A blend of DDTU and DBDE at a mass ratio of 1∶1, referred to as "UE", was added into the resin matrix at the mass fraction of 20% to prepare a novel low-shrinkage resin adhesive.Then, the methacrylate resin adhesive without UE was used as the blank control group, and a commercial resin adhesive system was selected as the commercial control group. Moreover, the resin-dentin bonding and micro-leakage testing specimens were prepared for the thermal cycling aging treatment. The bonding strength was tested, the fracture modes were calculated, the bonding fracture surface was observed by scanning electron microscope (SEM), and the dye penetration was used to evaluate the tooth-restoration marginal interface micro-leakage. All the data were analyzed statistically.

Results: After aging, the dentin bonding strength of the experimental group was (19.20±1.03) MPa without a significant decrease (P>0.05), that of the blank control group was (11.22±1.48) MPa with a significant decrease (P<0.05) and that of the commercial control group was (19.16±1.68) MPa without a significant decrease (P>0.05). The interface fracture was observed as the main fracture mode in each group after thermal cycling by SEM. The fractured bonding surfaces of the experimental group often occurred on the top of the hybrid layer, whereas those of the blank and commercial control groups mostly occurred on the bottom of the hybrid layer. Micro-leakage rating counts of specimens before and after thermal cycling were as follows: the experimental group was primarily 0 grade, thereby indicating that a relatively ideal marginal sealing effect could be achieved (P>0.05); meanwhile, the blank control group was primarily 1 grade, and the penetration depth of dye significantly increased after thermal cycling (P<0.05); the commercial control group was primarily 0 grade without statistical difference before and after thermal cycling (P>0.05), while a significant difference was observed between the commercial control group and experimental group after thermal cycling (P<0.05).

Conclusions: The novel low-shrinkage resin adhesive containing 20%UE exhibited excellent bonding properties even after thermal cycling aging treatment, thereby showing a promising prospect for dental application.

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热循环对新型低收缩树脂胶粘剂粘接性能的影响。
目的:研究一种新型含膨胀单体和环氧树脂单体的低收缩率树脂胶粘剂在热循环老化处理后的粘接性能。方法:合成以3,9-二乙基-3,9-二甲基-1,5,7,11-四氧螺-[5,5]十一烷(DDTU)为抗收缩添加剂的膨胀单体和以双烯丙基双酚A二缩水甘油醚(DBDE)为偶联剂的不饱和环氧单体。将DDTU和DBDE按质量比为1∶1的掺合物(UE)以20%的质量分数加入到树脂基体中,制备新型低收缩树脂胶粘剂。然后以不含UE的甲基丙烯酸酯树脂胶粘剂作为空白对照组,选择一种商用树脂胶粘剂体系作为商用对照组。制备了树脂-牙本质结合试样和微泄漏试样进行热循环时效处理。测试结合强度,计算断裂模式,扫描电镜(SEM)观察结合断裂面,染料穿透度评价牙修复边缘界面微泄漏。所有数据进行统计学分析。结果:老化后,实验组牙本质结合强度为(19.20±1.03)MPa,无显著降低(P>0.05);空白对照组牙本质结合强度为(11.22±1.48)MPa,无显著降低(PP>0.05)。热循环后,扫描电镜观察到各组试样的主要断裂方式为界面断裂。实验组的断裂粘接面多出现在杂化层的顶部,而空白组和商业对照组的断裂粘接面多出现在杂化层的底部。热循环前后试件微泄漏等级计数如下:实验组以0级为主,边际密封效果较为理想(P>0.05);空白对照组以1级为主,热循环后染料的渗透深度显著增加(PP>0.05),而热循环后商品对照组与实验组之间差异显著(p)。结论:含20%UE的新型低收缩率树脂胶粘剂在热循环老化处理后仍具有良好的粘接性能,具有良好的牙科应用前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
华西口腔医学杂志
华西口腔医学杂志 Medicine-Medicine (all)
CiteScore
0.80
自引率
0.00%
发文量
6397
期刊介绍: West China Journal of Stomatology (WCJS, pISSN 1000-1182, eISSN 2618-0456, CN 51-1169/R), published bimonthly, is a peer-reviewed Open Access journal, hosted by Sichuan university and Ministry of Education of the People's Republic of China. WCJS was established in 1983 and indexed in Medline/Pubmed, SCOPUS, EBSCO, Chemical Abstract(CA), CNKI, WANFANG Data, etc.
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