门级建模的CMOS电路仿真与最终finfet

N. Chevillon, M. Madec, C. Lallement
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引用次数: 0

摘要

由于当前数字电路的高度复杂性,在设计过程中必须使用门级模型。对于标准CMOS技术,设计人员组装标准单元,而栅极级模型由代工厂提供。对于给定的技术,时间参数(如传播延迟)是可以从实验测量中提取的常数。对于基于finfet的电路,这样的标准单元不存在。因此,为了对电路进行预测模拟,需要使用低级模型。为了克服这个问题,我们为这种电路开发了一个预测门级模型。为了给模型的定时参数提供信息,建立了一个自动化程序。它是基于一个新的紧凑模型的终极FinFET主要基于物理方程我们最近发展。最后对两种方法(紧凑模型和门级模型)的结果进行了比较。对于一个大约有80个晶体管的数字电路,结果是一致的。门级模型的轻微误差在很大程度上可以通过极短的仿真时间得到补偿。
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Gate-level modeling for CMOS circuit simulation with ultimate FinFETs
With the high complexity of current digital circuits, the use of gate-level models during the design process is mandatory. For standard CMOS technologies, designers assemble standard cells for which the gate-level model is provided by the founderies. For a given technology, the temporal parameters (such as propagation delays) are constants that can be extracted from experimental measurements. For FinFET-based circuits, such standard cells do not exist. As a consequence, to get predictive simulations of a circuit, the use of low-level model is required. To overcome this problem, we develop a predictive gate-level model for such circuits. To feed the timing parameters of the models, an automated procedure is established. It is based on a new compact model for ultimate FinFET mostly based on physical equations we recently develop. The results obtained with both approaches (compact model and gate-level model) are compared in the last part of the paper. For a digital circuit with about 80 transistors, the results are in accordance. The slight inaccuracy of the gate-level model is largely compensated by a very short simulation time.
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