用于地球静止卫星有效载荷的柔性输入多路复用的紧凑微波二极管开关矩阵的工业级实现

Alexander Ebert, S. Kaleem, J. Muller, R. Stephan, D. Stopel, T. Kasser, W. Konrath, M. Hein
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引用次数: 5

摘要

我们开发了一种电子可重构4×4开关矩阵,用于ka波段下行频率(17…22 GHz),采用低温共烧陶瓷多层技术。在一颗德国试验卫星上成功进行的为期一年的在轨核查中,开关矩阵显示出连续可靠的运行,并达到了低地球轨道任务的技术准备水平(TRL = 9)。基于这些有希望的结果和潜在的资格认证能力,我们设计了一个高级版本的开关矩阵,作为灵活输入多路复用器的一部分,用于在德国地球同步海因里希-赫兹任务的整个运行寿命期间运行。这种方法的挑战在于将最新的研究概念与工业级空间微波系统封装方法相结合,包括自动化混合装配过程,遵循卫星有效载荷系统的最高标准。除了在轨道上引入和验证新技术,从而总体上缩短未来卫星有效载荷的设计周期外,提高模块的可重复性和可靠性以及降低制造成本是进一步的重要结果。该开关矩阵集成了双面混合集成、裸模组件的密封、符合空间要求的pin -二极管开关ic和线键同轴连接器。
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An industry-level implementation of a compact microwave diode switch matrix for flexible input multiplexing if a geo-stationary satellite payload
We have developed a electronically reconfigurable 4×4 switch matrix for satellite communications at Ka-band downlink frequencies (17 ... 22 GHz), utilizing low-temperature co-fired ceramic multilayer technology. During a successful one-year on-orbit verification aboard a German test satellite, the switch matrix showed continuous reliable operation and achieved the technology-readiness level (TRL = 9) for low-earth orbit missions. Based on these promising results und underlying qualification capabilities, we have designed an advanced version of the switch matrix as part of a flexible input multiplexer for operation during the entire operational lifetime of the German geo-stationary Heinrich-Hertz mission. The challenge of this approach lies in the combination of latest research concepts with an industry-level space-qualified microwave system-in-package approach including an automated hybrid assembly process, following the highest standards for satellite payload systems. Beside introducing and verifying new technologies in orbit, and thus reducing the design cycles for future satellite payloads in general, increased reproducibility and reliability of the module, and reduced manufacturing costs are further important consequences. The switch matrix incorporates double-sided hybrid integration, hermetic sealing of bare-die components, space-qualified PIN-diode switch-ICs, and wire-bonded coaxial connectors.
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