片上系统(soc)的制造测试

J. Abraham
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引用次数: 1

摘要

与在芯片上生产晶体管不同的是,在芯片制造后进行测试,并不像摩尔定律那样具有可扩展性。本教程将概述制造测试的日益困难,并讨论管理测试soc复杂性的方法,包括针对经典“卡在”故障的生成和测试设计技术,以及在规模技术中越来越常见的小延迟缺陷。将讨论测试嵌入式模拟、混合信号和射频模块的问题。还将讨论使用(SoC)内的计算资源来测试自身的测试方法。SoC中的嵌入式处理器可以通过从存储器中运行指令序列来测试自己。该处理器可用于测试SoC中的其他核心,包括模拟和RF规格的混合信号核心,借助片上传感器等专为测试而设计的结构。
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“Manufacturing test of systems-on-a-chip (SoCs)”
Testing chips after manufacture, unlike producing transistors on a chip, does not enjoy the scaling offered by Moore's law. This tutorial will outline the increasing difficulties with manufacturing test and discuss approaches to manage the complexity of testing SoCs, including generation and design-for-test techniques for classic “stuck-at” faults as well as small delay defects which are becoming more common in scaled technologies. Issues with testing embedded analog, mixed-signal and RF modules will be addressed. Test approaches which use the computational resources within a (SoC) to test itself will also be discussed. The embedded processor in the SoC can test itself by running instruction sequences from memory. The processor can be used to test other cores in the SoC, including mixed-signal cores for analog and RF specifications, with the help of design-for-test structures such as on-chip sensors.
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Keynote speaker An analytical model to estimate PCM failure probability due to process variations A high-performance low VMIN 55nm 512Kb disturb-free 8T SRAM with adaptive VVSS control “Manufacturing test of systems-on-a-chip (SoCs)” A silicon core for an acoustic archival tag
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