硅基光子集成电路的耦合与封装问题

2012 Asia Communications and Photonics Conference (ACP) Pub Date : 2012-11-07 DOI:10.1364/ACPC.2012.ATh3B.1

C. Kopp, S. Bernabé, D. Fowler, P. Grosse, J. Fédéli, S. Menezo

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摘要

我们回顾了硅光子电路光纤耦合所面临的两个相反的挑战。首先是高性能，对发射器和接收器有不同的要求。第二个是包装装配公差。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Coupling and packaging issues of silicon based photonic integrated circuits

We review the two opposing challenges that fiber coupling of silicon photonic circuits has to deal with. The first being high performance with different requirements for emitters and receivers. The second being that of packaging assembly tolerances.

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2012 Asia Communications and Photonics Conference (ACP)

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