{"title":"最新微处理器耗损机制的比较研究","authors":"Chang-Chih Chen, Fahad Ahmed, L. Milor","doi":"10.1109/ICCD.2012.6378651","DOIUrl":null,"url":null,"abstract":"In this work, we perform a comparative study of different wearout mechanisms affecting the state-of-art microprocessor systems. Taking into account the detailed thermal and electrical stress profiles, we present a methodology to accurately estimate the lifetime due to each mechanism. The lifetime-limiting wearout mechanisms are highlighted using standard benchmarks along with the reliability-critical microprocessor functional units.","PeriodicalId":313428,"journal":{"name":"2012 IEEE 30th International Conference on Computer Design (ICCD)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2012-09-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"A comparative study of wearout mechanisms in state-of-art microprocessors\",\"authors\":\"Chang-Chih Chen, Fahad Ahmed, L. Milor\",\"doi\":\"10.1109/ICCD.2012.6378651\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work, we perform a comparative study of different wearout mechanisms affecting the state-of-art microprocessor systems. Taking into account the detailed thermal and electrical stress profiles, we present a methodology to accurately estimate the lifetime due to each mechanism. The lifetime-limiting wearout mechanisms are highlighted using standard benchmarks along with the reliability-critical microprocessor functional units.\",\"PeriodicalId\":313428,\"journal\":{\"name\":\"2012 IEEE 30th International Conference on Computer Design (ICCD)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-09-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE 30th International Conference on Computer Design (ICCD)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICCD.2012.6378651\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE 30th International Conference on Computer Design (ICCD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCD.2012.6378651","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A comparative study of wearout mechanisms in state-of-art microprocessors
In this work, we perform a comparative study of different wearout mechanisms affecting the state-of-art microprocessor systems. Taking into account the detailed thermal and electrical stress profiles, we present a methodology to accurately estimate the lifetime due to each mechanism. The lifetime-limiting wearout mechanisms are highlighted using standard benchmarks along with the reliability-critical microprocessor functional units.