减少a-Si/uc-Si串联光伏组件降解的创新钝化方法

Chih-Wei Chang, Ching-In Wu, Kai-Hsiang Chuang, Chih-Hsiung Chang, K. Lin, Chin-Yao Tsai
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引用次数: 0

摘要

通过对μc-Si材料进行良好的钝化处理,提高了标准a-Si/μc-Si串联模块和建筑集成光伏(BIPV)的稳定功率。采用外钝化技术后,开路电压(Voc)几乎保持不变,且与参考值相比,Voc(~ 3%)和填充因子(~ 5%)均有显著提高。在目前的工作中,对微晶硅进行了良好的钝化处理,以防止裂纹的后氧化。通过这种独特的技术可以观察到大约9%的降解行为改善和出色的BIPV性能(93%)。
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Innovative passivation for reducing degradation of a-Si/uc-Si tandem photovaltaic module
The innovative passivation treatment has been developed for increasing the stabilized power of standard a-Si/μc-Si tandem module and building-integrated photovoltaic (BIPV) via well passivation of μc-Si material. By adopting external passivation technique, the open-circuit voltage (Voc) almost keeps in constant, furthermore, a significant improvement of Voc (∼3%) and fill factor (∼5%) could be obtained as comparing to reference ones. In the present work, a well passivation treatment for microcrystalline Si to prevent the post-oxidation of the cracks has been reported. About 9 % of improvement of degradation behavior and an outstanding performance of BIPV (93%) could be observed by this unique technique.
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