H. Bello, O. Oyeleke, A. D. Usman, T. Bello, Idris Muhammad, O. S. Zakariyya
{"title":"基于三维mimics技术的紧凑型CPW传输线的建模与实现","authors":"H. Bello, O. Oyeleke, A. D. Usman, T. Bello, Idris Muhammad, O. S. Zakariyya","doi":"10.1109/ICECCO48375.2019.9043289","DOIUrl":null,"url":null,"abstract":"The two dimensional monolithic microwave integrated circuits (2D MMIC) are mainly implemented in a planar fashion and use microstrip design based technology. At microwave frequency and above, they would require a large amount of passive circuitry therefore occupying a great deal of space (area). Furthermore the 2D MMIC is associated with some disadvantages ranging from the use of very thin substrate which makes it less reliable, to very delicate substrate due to the use of via-hole technology, coupling issue and high cost due to large area it occupies. To solve these problems a three-dimensional multilayer technique 3D MMIC was used. The design of the 3D MMIC is based on coplanar waveguide (CPW), in this design the signal is protected by the two grounds on both side, the circuit becomes more compact, cost-effective and with improved performance. This research work was aimed at the design, modelling and investigation of a GaAs based multilayer compact 3D MMIC transmission line. Different transmission lines were designed and modelled using Agilent’s Advanced Design System (ADS) and their Sparameters were extracted using Electromagnetic (EM) simulator momentum.","PeriodicalId":166322,"journal":{"name":"2019 15th International Conference on Electronics, Computer and Computation (ICECCO)","volume":"2 4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Modelling And Realization of a Compact CPW Transmission Lines Using 3D Mmics Technology in ADS Momentum\",\"authors\":\"H. Bello, O. Oyeleke, A. D. Usman, T. Bello, Idris Muhammad, O. S. Zakariyya\",\"doi\":\"10.1109/ICECCO48375.2019.9043289\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The two dimensional monolithic microwave integrated circuits (2D MMIC) are mainly implemented in a planar fashion and use microstrip design based technology. At microwave frequency and above, they would require a large amount of passive circuitry therefore occupying a great deal of space (area). Furthermore the 2D MMIC is associated with some disadvantages ranging from the use of very thin substrate which makes it less reliable, to very delicate substrate due to the use of via-hole technology, coupling issue and high cost due to large area it occupies. To solve these problems a three-dimensional multilayer technique 3D MMIC was used. The design of the 3D MMIC is based on coplanar waveguide (CPW), in this design the signal is protected by the two grounds on both side, the circuit becomes more compact, cost-effective and with improved performance. This research work was aimed at the design, modelling and investigation of a GaAs based multilayer compact 3D MMIC transmission line. Different transmission lines were designed and modelled using Agilent’s Advanced Design System (ADS) and their Sparameters were extracted using Electromagnetic (EM) simulator momentum.\",\"PeriodicalId\":166322,\"journal\":{\"name\":\"2019 15th International Conference on Electronics, Computer and Computation (ICECCO)\",\"volume\":\"2 4 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 15th International Conference on Electronics, Computer and Computation (ICECCO)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICECCO48375.2019.9043289\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 15th International Conference on Electronics, Computer and Computation (ICECCO)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICECCO48375.2019.9043289","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Modelling And Realization of a Compact CPW Transmission Lines Using 3D Mmics Technology in ADS Momentum
The two dimensional monolithic microwave integrated circuits (2D MMIC) are mainly implemented in a planar fashion and use microstrip design based technology. At microwave frequency and above, they would require a large amount of passive circuitry therefore occupying a great deal of space (area). Furthermore the 2D MMIC is associated with some disadvantages ranging from the use of very thin substrate which makes it less reliable, to very delicate substrate due to the use of via-hole technology, coupling issue and high cost due to large area it occupies. To solve these problems a three-dimensional multilayer technique 3D MMIC was used. The design of the 3D MMIC is based on coplanar waveguide (CPW), in this design the signal is protected by the two grounds on both side, the circuit becomes more compact, cost-effective and with improved performance. This research work was aimed at the design, modelling and investigation of a GaAs based multilayer compact 3D MMIC transmission line. Different transmission lines were designed and modelled using Agilent’s Advanced Design System (ADS) and their Sparameters were extracted using Electromagnetic (EM) simulator momentum.