新千年之初的电力电子技术——现状与未来

J. D. van Wyk, F. Lee
{"title":"新千年之初的电力电子技术——现状与未来","authors":"J. D. van Wyk, F. Lee","doi":"10.1109/PESC.1999.788973","DOIUrl":null,"url":null,"abstract":"The paper examines the status of power electronics technology by looking at eight constituent technologies (power switch technology, passive components, power switching network technology, packaging technology, environmental impact technology, cooling technology, manufacturing technology, and converter control technology). The present trends are then discussed from the point of view of some of these that can be considered internal drivers, as well as from the viewpoint of those that are external drivers. Packaging as a central driver is evaluated and the necessity for a paradigm shift in power electronics technology identified. Future possibilities in terms of electromagnetic integration of passives and of integrated power electronic modules (IPEMs) are discussed.","PeriodicalId":292317,"journal":{"name":"30th Annual IEEE Power Electronics Specialists Conference. Record. (Cat. No.99CH36321)","volume":"67 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"150","resultStr":"{\"title\":\"Power electronics technology at the dawn of the new millenium-status and future\",\"authors\":\"J. D. van Wyk, F. Lee\",\"doi\":\"10.1109/PESC.1999.788973\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper examines the status of power electronics technology by looking at eight constituent technologies (power switch technology, passive components, power switching network technology, packaging technology, environmental impact technology, cooling technology, manufacturing technology, and converter control technology). The present trends are then discussed from the point of view of some of these that can be considered internal drivers, as well as from the viewpoint of those that are external drivers. Packaging as a central driver is evaluated and the necessity for a paradigm shift in power electronics technology identified. Future possibilities in terms of electromagnetic integration of passives and of integrated power electronic modules (IPEMs) are discussed.\",\"PeriodicalId\":292317,\"journal\":{\"name\":\"30th Annual IEEE Power Electronics Specialists Conference. Record. (Cat. No.99CH36321)\",\"volume\":\"67 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"150\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"30th Annual IEEE Power Electronics Specialists Conference. Record. (Cat. No.99CH36321)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/PESC.1999.788973\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"30th Annual IEEE Power Electronics Specialists Conference. Record. (Cat. No.99CH36321)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/PESC.1999.788973","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 150

摘要

本文从电源开关技术、无源元件技术、电源交换网络技术、封装技术、环境影响技术、冷却技术、制造技术和变换器控制技术这八项构成技术考察了电力电子技术的现状。然后从其中一些可被视为内部驱动因素的角度以及从外部驱动因素的角度讨论当前的趋势。封装作为一个核心驱动程序进行评估,并确定了电力电子技术范式转变的必要性。讨论了无源电磁集成和集成电力电子模块(IPEMs)的未来可能性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Power electronics technology at the dawn of the new millenium-status and future
The paper examines the status of power electronics technology by looking at eight constituent technologies (power switch technology, passive components, power switching network technology, packaging technology, environmental impact technology, cooling technology, manufacturing technology, and converter control technology). The present trends are then discussed from the point of view of some of these that can be considered internal drivers, as well as from the viewpoint of those that are external drivers. Packaging as a central driver is evaluated and the necessity for a paradigm shift in power electronics technology identified. Future possibilities in terms of electromagnetic integration of passives and of integrated power electronic modules (IPEMs) are discussed.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
A generic power converter modeling method to support computer-aided design and synthesis A new family of zero-current-switching PWM converter High voltage multilevel converter with regeneration capability An efficient PFC voltage regulator with reduced redundant power processing Switched-capacitor DC-DC converters for low-power on-chip applications
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1