{"title":"新千年之初的电力电子技术——现状与未来","authors":"J. D. van Wyk, F. Lee","doi":"10.1109/PESC.1999.788973","DOIUrl":null,"url":null,"abstract":"The paper examines the status of power electronics technology by looking at eight constituent technologies (power switch technology, passive components, power switching network technology, packaging technology, environmental impact technology, cooling technology, manufacturing technology, and converter control technology). The present trends are then discussed from the point of view of some of these that can be considered internal drivers, as well as from the viewpoint of those that are external drivers. Packaging as a central driver is evaluated and the necessity for a paradigm shift in power electronics technology identified. Future possibilities in terms of electromagnetic integration of passives and of integrated power electronic modules (IPEMs) are discussed.","PeriodicalId":292317,"journal":{"name":"30th Annual IEEE Power Electronics Specialists Conference. Record. (Cat. No.99CH36321)","volume":"67 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"150","resultStr":"{\"title\":\"Power electronics technology at the dawn of the new millenium-status and future\",\"authors\":\"J. D. van Wyk, F. Lee\",\"doi\":\"10.1109/PESC.1999.788973\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper examines the status of power electronics technology by looking at eight constituent technologies (power switch technology, passive components, power switching network technology, packaging technology, environmental impact technology, cooling technology, manufacturing technology, and converter control technology). The present trends are then discussed from the point of view of some of these that can be considered internal drivers, as well as from the viewpoint of those that are external drivers. Packaging as a central driver is evaluated and the necessity for a paradigm shift in power electronics technology identified. Future possibilities in terms of electromagnetic integration of passives and of integrated power electronic modules (IPEMs) are discussed.\",\"PeriodicalId\":292317,\"journal\":{\"name\":\"30th Annual IEEE Power Electronics Specialists Conference. Record. (Cat. No.99CH36321)\",\"volume\":\"67 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"150\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"30th Annual IEEE Power Electronics Specialists Conference. Record. (Cat. No.99CH36321)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/PESC.1999.788973\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"30th Annual IEEE Power Electronics Specialists Conference. Record. (Cat. No.99CH36321)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/PESC.1999.788973","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Power electronics technology at the dawn of the new millenium-status and future
The paper examines the status of power electronics technology by looking at eight constituent technologies (power switch technology, passive components, power switching network technology, packaging technology, environmental impact technology, cooling technology, manufacturing technology, and converter control technology). The present trends are then discussed from the point of view of some of these that can be considered internal drivers, as well as from the viewpoint of those that are external drivers. Packaging as a central driver is evaluated and the necessity for a paradigm shift in power electronics technology identified. Future possibilities in terms of electromagnetic integration of passives and of integrated power electronic modules (IPEMs) are discussed.