{"title":"大电流pcb -母线和电子元件的系统集成","authors":"C. Lehnberger","doi":"10.1109/EDPC.2011.6085550","DOIUrl":null,"url":null,"abstract":"This paper presents a technique to combine high currents and microelectronic control in a single system for power train and power supply applications. The combination is achieved by incorporation of busbars and other massive copper bars into a printed circuit board (PCB) to obtain high current load capability as well as heat sink for components with considerable power dissipation. Typical applications of automotive industry or avionics handle currents in the order of up to 1000 Ampere.","PeriodicalId":333533,"journal":{"name":"2011 1st International Electric Drives Production Conference","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2011-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"High current PCBs - system integration of busbars and electronics\",\"authors\":\"C. Lehnberger\",\"doi\":\"10.1109/EDPC.2011.6085550\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a technique to combine high currents and microelectronic control in a single system for power train and power supply applications. The combination is achieved by incorporation of busbars and other massive copper bars into a printed circuit board (PCB) to obtain high current load capability as well as heat sink for components with considerable power dissipation. Typical applications of automotive industry or avionics handle currents in the order of up to 1000 Ampere.\",\"PeriodicalId\":333533,\"journal\":{\"name\":\"2011 1st International Electric Drives Production Conference\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-11-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 1st International Electric Drives Production Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDPC.2011.6085550\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 1st International Electric Drives Production Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDPC.2011.6085550","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
High current PCBs - system integration of busbars and electronics
This paper presents a technique to combine high currents and microelectronic control in a single system for power train and power supply applications. The combination is achieved by incorporation of busbars and other massive copper bars into a printed circuit board (PCB) to obtain high current load capability as well as heat sink for components with considerable power dissipation. Typical applications of automotive industry or avionics handle currents in the order of up to 1000 Ampere.
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