Z. Mironova, D. Kariagina, B. Vladimirov, A. Pavlov
{"title":"高密度导电线路板通孔的质量保证","authors":"Z. Mironova, D. Kariagina, B. Vladimirov, A. Pavlov","doi":"10.17238/issn2409-0239.2015.4.87","DOIUrl":null,"url":null,"abstract":". The paper proposes analysis of quality assurance of via holes in the wiring board with high density conductive pattern. The main attention is paid to the formation of filled via holes, as well as to metallization protection from possible residual technological solutions and fluxing agents. Results of various methods to fill the transition holes are shown.","PeriodicalId":436954,"journal":{"name":"Rocket-Space Device Engineering and Information Systems","volume":"58 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Quality Assurance of via Holes in the Wiring Board with High Density Conductive Pattern\",\"authors\":\"Z. Mironova, D. Kariagina, B. Vladimirov, A. Pavlov\",\"doi\":\"10.17238/issn2409-0239.2015.4.87\",\"DOIUrl\":null,\"url\":null,\"abstract\":\". The paper proposes analysis of quality assurance of via holes in the wiring board with high density conductive pattern. The main attention is paid to the formation of filled via holes, as well as to metallization protection from possible residual technological solutions and fluxing agents. Results of various methods to fill the transition holes are shown.\",\"PeriodicalId\":436954,\"journal\":{\"name\":\"Rocket-Space Device Engineering and Information Systems\",\"volume\":\"58 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Rocket-Space Device Engineering and Information Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.17238/issn2409-0239.2015.4.87\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Rocket-Space Device Engineering and Information Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.17238/issn2409-0239.2015.4.87","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Quality Assurance of via Holes in the Wiring Board with High Density Conductive Pattern
. The paper proposes analysis of quality assurance of via holes in the wiring board with high density conductive pattern. The main attention is paid to the formation of filled via holes, as well as to metallization protection from possible residual technological solutions and fluxing agents. Results of various methods to fill the transition holes are shown.
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