高速互连优化

Mallikarjun Vasa, Arun Chada Reddy, B. Mutnury, Sanjay Kumar, R. Vasanth
{"title":"高速互连优化","authors":"Mallikarjun Vasa, Arun Chada Reddy, B. Mutnury, Sanjay Kumar, R. Vasanth","doi":"10.1109/APEMC.2015.7175345","DOIUrl":null,"url":null,"abstract":"As the signal speeds begin to increase, small routing imperfections start to dictate the overall channel performance. Commonly found routing imperfections such as trace breakout, via discontinuity and AC coupling capacitor pad capacitance need to be further optimized to meet the desired channel specification based on bit error rate (BER). Upfront modeling and analysis of such imperfections at high frequencies can mitigate expensive board redesigns to achieve the desired performance. This paper demonstrates the impact of each such routing imperfection(s) for data rates up to 40 Gbps. Model to hardware correlation is performed to ensure model accuracy. The impact physical routing parameters on return and insertion loss in frequency and time domain are studied to help designers optimize their channel.","PeriodicalId":325138,"journal":{"name":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"High speed interconnect optimization\",\"authors\":\"Mallikarjun Vasa, Arun Chada Reddy, B. Mutnury, Sanjay Kumar, R. Vasanth\",\"doi\":\"10.1109/APEMC.2015.7175345\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As the signal speeds begin to increase, small routing imperfections start to dictate the overall channel performance. Commonly found routing imperfections such as trace breakout, via discontinuity and AC coupling capacitor pad capacitance need to be further optimized to meet the desired channel specification based on bit error rate (BER). Upfront modeling and analysis of such imperfections at high frequencies can mitigate expensive board redesigns to achieve the desired performance. This paper demonstrates the impact of each such routing imperfection(s) for data rates up to 40 Gbps. Model to hardware correlation is performed to ensure model accuracy. The impact physical routing parameters on return and insertion loss in frequency and time domain are studied to help designers optimize their channel.\",\"PeriodicalId\":325138,\"journal\":{\"name\":\"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)\",\"volume\":\"43 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-05-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/APEMC.2015.7175345\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APEMC.2015.7175345","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

摘要

当信号速度开始增加时,小的路由缺陷开始决定整个信道的性能。常见的布线缺陷,如走线断线、通过不连续和交流耦合电容垫电容需要进一步优化,以满足基于误码率(BER)的所需通道规格。在高频下对这些缺陷进行前期建模和分析可以减少昂贵的电路板重新设计,以实现所需的性能。本文演示了每种路由缺陷对高达40 Gbps的数据速率的影响。进行了模型与硬件的关联,保证了模型的准确性。研究了物理路由参数在频域和时域上对回波和插入损耗的影响,以帮助设计人员优化信道。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
High speed interconnect optimization
As the signal speeds begin to increase, small routing imperfections start to dictate the overall channel performance. Commonly found routing imperfections such as trace breakout, via discontinuity and AC coupling capacitor pad capacitance need to be further optimized to meet the desired channel specification based on bit error rate (BER). Upfront modeling and analysis of such imperfections at high frequencies can mitigate expensive board redesigns to achieve the desired performance. This paper demonstrates the impact of each such routing imperfection(s) for data rates up to 40 Gbps. Model to hardware correlation is performed to ensure model accuracy. The impact physical routing parameters on return and insertion loss in frequency and time domain are studied to help designers optimize their channel.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Near field measurement for EMC validation of electronics board in IMA A two-step approach for EMI evaluation of a wearable ECG Asymptotic analysis of scattering from reflectarray antennas for the near-field focused applications A collective uniform geometrical theory of diffraction ray field analysis of very long and narrow finite planar arrays The effect of magneto-dielectric absorbing coating on unsymmetrical antenna cables
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1