{"title":"采用烧结技术的新一代汽车电源模块","authors":"J. Steger","doi":"10.1109/EDPC.2011.6085549","DOIUrl":null,"url":null,"abstract":"One of the large challenges for the whole power electronic industry is presents by the automotive industry. Unprecedented combinations of thermal, electrical, and reliability performance with a very small volume and weight, will be demanded. A consistent further development of the sinter technology comprises an excellent answer to all this requirements. Sinter technology substitute all solder connections and also the aluminium bond wires. These are the present weak points in a standard power module. All sinter process steps will be described: The sintering of power chips to a ceramic substrate (i.e. DBC), a top side sintering of the power chips to a flexible circuit board, and the sinter process of the whole assembled substrate to a pin-fin heat sink. The thermal and reliability results of a 400 Amp, 600 V Dual IGBT, will be shown.","PeriodicalId":333533,"journal":{"name":"2011 1st International Electric Drives Production Conference","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2011-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"A new generation of power modules with sinter-technology for the automotive industry\",\"authors\":\"J. Steger\",\"doi\":\"10.1109/EDPC.2011.6085549\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"One of the large challenges for the whole power electronic industry is presents by the automotive industry. Unprecedented combinations of thermal, electrical, and reliability performance with a very small volume and weight, will be demanded. A consistent further development of the sinter technology comprises an excellent answer to all this requirements. Sinter technology substitute all solder connections and also the aluminium bond wires. These are the present weak points in a standard power module. All sinter process steps will be described: The sintering of power chips to a ceramic substrate (i.e. DBC), a top side sintering of the power chips to a flexible circuit board, and the sinter process of the whole assembled substrate to a pin-fin heat sink. The thermal and reliability results of a 400 Amp, 600 V Dual IGBT, will be shown.\",\"PeriodicalId\":333533,\"journal\":{\"name\":\"2011 1st International Electric Drives Production Conference\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-11-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 1st International Electric Drives Production Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDPC.2011.6085549\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 1st International Electric Drives Production Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDPC.2011.6085549","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A new generation of power modules with sinter-technology for the automotive industry
One of the large challenges for the whole power electronic industry is presents by the automotive industry. Unprecedented combinations of thermal, electrical, and reliability performance with a very small volume and weight, will be demanded. A consistent further development of the sinter technology comprises an excellent answer to all this requirements. Sinter technology substitute all solder connections and also the aluminium bond wires. These are the present weak points in a standard power module. All sinter process steps will be described: The sintering of power chips to a ceramic substrate (i.e. DBC), a top side sintering of the power chips to a flexible circuit board, and the sinter process of the whole assembled substrate to a pin-fin heat sink. The thermal and reliability results of a 400 Amp, 600 V Dual IGBT, will be shown.
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