{"title":"三维互连结构和任意形状集成无源的广义PEEC模型","authors":"A. Rong, A. Cangellaris","doi":"10.1109/EPEP.2001.967651","DOIUrl":null,"url":null,"abstract":"This paper presents the generalization of the Partial Element Equivalent Circuit method that facilitates its application to the modeling of structures of arbitrary shapes. This is achieved through the development of partial element equivalent circuit models using triangular cells and prisms as the fundamental building blocks for modeling conductor surfaces and conductor/dielectric volumes. The new Partial Element Equivalent Circuit models are demonstrated through their application to the quantification of electromagnetic coupling in crossing wires.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"235 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"36","resultStr":"{\"title\":\"Generalized PEEC models for three-dimensional interconnect structures and integrated passives of arbitrary shapes\",\"authors\":\"A. Rong, A. Cangellaris\",\"doi\":\"10.1109/EPEP.2001.967651\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the generalization of the Partial Element Equivalent Circuit method that facilitates its application to the modeling of structures of arbitrary shapes. This is achieved through the development of partial element equivalent circuit models using triangular cells and prisms as the fundamental building blocks for modeling conductor surfaces and conductor/dielectric volumes. The new Partial Element Equivalent Circuit models are demonstrated through their application to the quantification of electromagnetic coupling in crossing wires.\",\"PeriodicalId\":174339,\"journal\":{\"name\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"volume\":\"235 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-10-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"36\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2001.967651\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2001.967651","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Generalized PEEC models for three-dimensional interconnect structures and integrated passives of arbitrary shapes
This paper presents the generalization of the Partial Element Equivalent Circuit method that facilitates its application to the modeling of structures of arbitrary shapes. This is achieved through the development of partial element equivalent circuit models using triangular cells and prisms as the fundamental building blocks for modeling conductor surfaces and conductor/dielectric volumes. The new Partial Element Equivalent Circuit models are demonstrated through their application to the quantification of electromagnetic coupling in crossing wires.