三维互连结构和任意形状集成无源的广义PEEC模型

A. Rong, A. Cangellaris
{"title":"三维互连结构和任意形状集成无源的广义PEEC模型","authors":"A. Rong, A. Cangellaris","doi":"10.1109/EPEP.2001.967651","DOIUrl":null,"url":null,"abstract":"This paper presents the generalization of the Partial Element Equivalent Circuit method that facilitates its application to the modeling of structures of arbitrary shapes. This is achieved through the development of partial element equivalent circuit models using triangular cells and prisms as the fundamental building blocks for modeling conductor surfaces and conductor/dielectric volumes. The new Partial Element Equivalent Circuit models are demonstrated through their application to the quantification of electromagnetic coupling in crossing wires.","PeriodicalId":174339,"journal":{"name":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","volume":"235 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"36","resultStr":"{\"title\":\"Generalized PEEC models for three-dimensional interconnect structures and integrated passives of arbitrary shapes\",\"authors\":\"A. Rong, A. Cangellaris\",\"doi\":\"10.1109/EPEP.2001.967651\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the generalization of the Partial Element Equivalent Circuit method that facilitates its application to the modeling of structures of arbitrary shapes. This is achieved through the development of partial element equivalent circuit models using triangular cells and prisms as the fundamental building blocks for modeling conductor surfaces and conductor/dielectric volumes. The new Partial Element Equivalent Circuit models are demonstrated through their application to the quantification of electromagnetic coupling in crossing wires.\",\"PeriodicalId\":174339,\"journal\":{\"name\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"volume\":\"235 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-10-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"36\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2001.967651\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2001.967651","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 36

摘要

本文对部分单元等效电路方法进行了推广,使其易于应用于任意形状结构的建模。这是通过开发部分元件等效电路模型来实现的,该模型使用三角形单元和棱镜作为建模导体表面和导体/介电体体积的基本构建块。通过对交叉线中电磁耦合量化的应用,论证了新的部分元件等效电路模型。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Generalized PEEC models for three-dimensional interconnect structures and integrated passives of arbitrary shapes
This paper presents the generalization of the Partial Element Equivalent Circuit method that facilitates its application to the modeling of structures of arbitrary shapes. This is achieved through the development of partial element equivalent circuit models using triangular cells and prisms as the fundamental building blocks for modeling conductor surfaces and conductor/dielectric volumes. The new Partial Element Equivalent Circuit models are demonstrated through their application to the quantification of electromagnetic coupling in crossing wires.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Model extraction and waveform correlation via a generalized frequency- and time-domain optimizer Analysis of power/ground planes by PCB simulator with model order reduction technique Measuring radiation of small electronic equipment in three-dimensional TEM cells Generalized PEEC models for three-dimensional interconnect structures and integrated passives of arbitrary shapes Equivalent circuit representation and dimension reduction technique for efficient FDTD modeling of power/ground plane
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1