{"title":"微/纳米级的装配和包装自动化","authors":"M. Rakotondrabe, Y. Haddab, C. Clévy, P. Lutz","doi":"10.1109/CASE.2011.6042531","DOIUrl":null,"url":null,"abstract":"This paper provides a general overview of the material covered in the fullday workshop with the same title devoted to the field of automation in microassembly and packaging at the micro/nanoscale.","PeriodicalId":236208,"journal":{"name":"2011 IEEE International Conference on Automation Science and Engineering","volume":"48 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Automation of assembly and packaging at the micro/nano-scale\",\"authors\":\"M. Rakotondrabe, Y. Haddab, C. Clévy, P. Lutz\",\"doi\":\"10.1109/CASE.2011.6042531\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper provides a general overview of the material covered in the fullday workshop with the same title devoted to the field of automation in microassembly and packaging at the micro/nanoscale.\",\"PeriodicalId\":236208,\"journal\":{\"name\":\"2011 IEEE International Conference on Automation Science and Engineering\",\"volume\":\"48 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-10-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 IEEE International Conference on Automation Science and Engineering\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CASE.2011.6042531\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 IEEE International Conference on Automation Science and Engineering","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CASE.2011.6042531","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Automation of assembly and packaging at the micro/nano-scale
This paper provides a general overview of the material covered in the fullday workshop with the same title devoted to the field of automation in microassembly and packaging at the micro/nanoscale.
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