{"title":"用于新一代蓝牙应用的2.4GHz SOI CMOS功率放大器","authors":"Ying Ruan, Lei Chen, Fang Yang","doi":"10.1109/CCISP55629.2022.9974559","DOIUrl":null,"url":null,"abstract":"A 2.4GHz class E power amplifier (PA) for new generation Bluetooth Low Energy application is designed and implemented in 22nm silicon on insulator (SOI) CMOS technology. The proposed PA is fully integrated, which has a two-stage differential structure with cascode stacking power transistors to improve the efficiency and prevent the breakdown with almost no increase in die area. S parameter simulation results show that output impedance matching S22 is less than - 12.1dB in the frequency range from 2.4GHz to 2.5GHz. The power amplifier achieves a power gain of 15.9dB, output power of 4.9dBm, and a power added efficiency(PAE) of 41.5%.","PeriodicalId":431851,"journal":{"name":"2022 7th International Conference on Communication, Image and Signal Processing (CCISP)","volume":"171 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"A 2.4GHz SOI CMOS Power Amplifier for New Generation Bluetooth Application\",\"authors\":\"Ying Ruan, Lei Chen, Fang Yang\",\"doi\":\"10.1109/CCISP55629.2022.9974559\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A 2.4GHz class E power amplifier (PA) for new generation Bluetooth Low Energy application is designed and implemented in 22nm silicon on insulator (SOI) CMOS technology. The proposed PA is fully integrated, which has a two-stage differential structure with cascode stacking power transistors to improve the efficiency and prevent the breakdown with almost no increase in die area. S parameter simulation results show that output impedance matching S22 is less than - 12.1dB in the frequency range from 2.4GHz to 2.5GHz. The power amplifier achieves a power gain of 15.9dB, output power of 4.9dBm, and a power added efficiency(PAE) of 41.5%.\",\"PeriodicalId\":431851,\"journal\":{\"name\":\"2022 7th International Conference on Communication, Image and Signal Processing (CCISP)\",\"volume\":\"171 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 7th International Conference on Communication, Image and Signal Processing (CCISP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CCISP55629.2022.9974559\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 7th International Conference on Communication, Image and Signal Processing (CCISP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CCISP55629.2022.9974559","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A 2.4GHz SOI CMOS Power Amplifier for New Generation Bluetooth Application
A 2.4GHz class E power amplifier (PA) for new generation Bluetooth Low Energy application is designed and implemented in 22nm silicon on insulator (SOI) CMOS technology. The proposed PA is fully integrated, which has a two-stage differential structure with cascode stacking power transistors to improve the efficiency and prevent the breakdown with almost no increase in die area. S parameter simulation results show that output impedance matching S22 is less than - 12.1dB in the frequency range from 2.4GHz to 2.5GHz. The power amplifier achieves a power gain of 15.9dB, output power of 4.9dBm, and a power added efficiency(PAE) of 41.5%.