分析半透明和水绝缘体纳米复合树脂和二氧化物复合复合纳米绝缘体分析

A. Pratiwi, Muhammad Asri
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引用次数: 0

摘要

这项研究的目的是确定环氧树脂的半透明电压和含水率的性质,这种混合性和不含碳果核填料。增加15克的插入物,30克的玉米棒子,DGEBA 100毫升,MPDA 50毫升。SI00样本(无过滤)中半透明电压最高的值为74.64 kV,而SI45样本中的半透明电压为17.81 kV。增加填充材料样本数量只会加剧半导体的张力。SI15、SI30和SI45的样本是水力学或吸水的。在环氧树脂中加入填充物也会使绝缘体表面吸收水分。玉米棒子45克的样品中,已在17.81 kV的压力下破裂,因此不再进行其他测试条件。这个研究可以评估应力压力和氢化树脂溶剂的性质15克,30克和45克玉米棒子灰,100毫升DGEBA, 50毫升MPDA。人民币的分解方法以IEC 1109为基础,现有的水样测量方法以IEC 62073为基础。雪上加霜的唯一痕迹是雪上加霜增加过滤器的大小,只增加绝缘材料的分解电压。SI00, SI15, SI30和SI45是水状或吸收水。向环氧树脂添加的成分也能形成绝缘体吸收水的表面。在玉米cobs之样品和45克什填充物,它被严重损坏的at a 17 . 81的电压,所以这不能成为过去的其他测试条件。
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Analisis Tegangan Tembus Dan Hidrofobisitas Isolator Nano Komposit Resin Epoksi Dan SiO2
Penelitian ini bertujuan untuk mengetahui karakteristik tegangan tembus dan sifat hidrofobik dari isolator resin epoksi dengan dan tanpa bahan pengisi abu arang tongkol jagung. Penambahan bahan pengisi sebanyak 15 gram, 30 gram dan 45 gram abu arang tongkol jagung, DGEBA 100 ml, MPDA 50 ml. Metode pengujian tegangan tembus berdasarkan standar IEC 1109 dan metode pengukuran hidrofobisitas berdasarkan IEC 62073 yakni metode sudut kontak. Nilai Tegangan tembus tertinggi  pada sampel SI00 (tanpa filler) kondisi kering bersih yakni sebesar 74,64 kV dan tegangan tembus terendah pada sampel SI45 kondisi kering bersih sebesar 17,81 kV. Penambahan jumlah sampel bahan pengisi hanya memperburuk tegangan tembus isolator. Sampel SI00, SI15, SI30, dan SI45 bersifat hidrofilik atau menyerap air. Penambahan bahan pengisi pada resin epoksi juga semakin membuat permukaan isolator menyerap air. Pada sampel dengan bahan pengisi 45 gram abu tongkol jagung sudah mengalami breakdown pada tegangan 17,81 kV sehingga tidak dilanjutkan untuk kondisi pengujian yang lain.This study aims to measure the breakdown stress and hydrophobic properties of epoxy resin insulators with and without corncob charcoal ash as filler. Addition of filler as much as 15 grams, 30 grams and 45 grams of corncob charcoal ash, 100 ml DGEBA, 50 ml MPDA. The breakdown voltage testing method is based on IEC 1109 standard and the hydrophobicity measurement method according to IEC 62073 is the contact angle method. The highest value of the breakdown voltage in the SI00 sample (without filler) is in the clean dry condition of 74.64 kV and the lowest in the SI45 sample in the clean dry condition is 17.81 kV. Increasing the sample size of the filler only exacerbates the breakdown voltage of the insulator. Samples SI00, SI15, SI30, and SI45 are hydrophilic or absorb air. The addition of fillers to the epoxy resin also makes the surface of the insulator absorb air. In the sample with 45 grams of corn cobs ash filler, it has been damaged at a voltage of 17.81 kV so that it cannot be used for other test conditions. 
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