压力传感器膜片建模及变形分析

V.Mouliraj, Ramesh Kumar Yadav, N.Balachandar
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摘要

本文研究了基于微机电系统的压力传感器隔膜(MEMS)。本文旨在构建、建模和测试基于mems的膜片,该膜片使用相同面积和材料的许多结构来感知差压。相似的目标:使用COMSOL多物理场软件研究膜片挠度和灵敏度。LTspice是一个高性能的SPICE模拟器,具有图形原理图捕获接口。当压力变化时,膜片发生弯曲,通过改变三个传感器的电阻影响COMSOL中基片-膜片的位移和LTspice中的电压输出。电压输出随膜片弯曲而变化。电压和位移的变化表示环境压力。这种方法提高了仪器的响应。在这项工作中,基于圆形膜片的压力传感器比方形或矩形的压力传感器具有更高的位移、灵敏度和应力输出响应。
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Pressure sensor diaphragm modelling and deformation analysis
This paper develops Micro-electromechanical Systems-based pressure sensor diaphragms (MEMS). This paper aims to build, model, and test a MEMS-based diaphragm that uses numerous structures of the same area and material to sense differential pressure. Similar goals: Diaphragm deflection and sensitivity were studied using COMSOL multiphysics software. LTspice is a high-performance SPICE simulator with a graphical schematic capture interface. The diaphragm bends when pressure changes, affecting the substrate-diaphragm displacement in COMSOL and the voltage output in LTspice via changing the resistances of three sensors. Voltage output changes with diaphragm bending. Changing voltage and displacement indicate environmental pressure. This method improves instrument response. In this work, a circular diaphragm-based pressure sensor has higher displacement, sensitivity, and stress output responses than a square or rectangular one.
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